Parallel Semiconductor Module With PTC Paths for Current Balancing
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Solution Overview
Problem
The manufacturing process of semiconductor modules with parallel-connected switching elements is complex and costly due to the need for precise control elements to balance current distribution and prevent overheating.
Innovation Solution
Incorporating variable resistive members with a positive temperature coefficient in the connection paths between input and output electrodes of semiconductor switching elements to dynamically adjust resistance and balance current distribution, thereby simplifying the manufacturing process and reducing costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If control elements are joined onto emitter electrodes of power semiconductor elements to balance current distribution, then current imbalance is prevented and reliability is improved, but manufacturing process complexity increases and production costs rise
Solution Approach 1:
The patent combines the control element with the substrate by forming a common connection structure where the control element shares the substrate connection path with the power semiconductor element. This merging eliminates the need for separate emitter electrode connections, reducing manufacturing steps while maintaining current balancing functionality through the shared connection path.
Solution Approach 2:
The substrate connection path serves multiple functions simultaneously: it provides the electrical connection for the power semiconductor element and also serves as the connection path for the control element. This multi-functionality reduces the number of required connections and simplifies the manufacturing process while maintaining the current balancing effect.
2Reliability
If control elements are joined onto emitter electrodes to prevent overheating, then thermal management is improved, but manufacturing time and cost increase
Solution Approach 1:
The control element and power semiconductor element share a common connection path through the substrate, merging their thermal management functions. This allows heat dissipation to occur through the same thermal path for both elements, improving thermal management efficiency while reducing manufacturing steps and increasing production speed.
3Manufacturing precision
If separate control elements are connected to each power semiconductor element, then current balancing is achieved, but the number of manufacturing steps increases
Solution Approach 1:
The substrate connection path is designed to serve both power semiconductor elements and control elements simultaneously. This universal connection path maintains precise current balancing by providing controlled impedance paths while significantly reducing the number of discrete manufacturing steps required compared to separate connections for each element.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively prevents current imbalance and overheating in semiconductor switching elements, enhancing the reliability and reducing manufacturing costs by simplifying the module's design and production process.
Implementation Method 1
each of the first connection part and the second connection part includes, as a current path, a variable resistive member comprising material with a positive temperature resistance coefficient higher than a temperature resistance coefficient of material of the input part
Data Source
AI summary
A semiconductor module includes: a first semiconductor switching element including a first input electrode and a first output electrode; a second semiconductor switching element including a second input electrode and a second output electrode; an input part that receives an input of current; a first connection part that electrically connects the first input electrode and the input part; a second connection part that electrically connects the second input electrode and the input part; and an output part electrically connected to the first output electrode and the second output electrode. Each of the first connection part and the second connection part includes, as a current path, a variable resistive member comprising material with a positive temperature resistance coefficient higher than a temperature resistance coefficient of material of the input part.