Semiconductor Module Die Pad Frame Projection Design
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Solution Overview
Problem
Conventional semiconductor modules experience cracks and separation of sealing resin at the end portion of the die pad frame, which can lead to the flow of conductive connection members and compromise the electrical connection between the semiconductor chip and the die pad frame.
Innovation Solution
A semiconductor module design featuring a die pad frame with a projection and locking portion at its end, where the locking portion is partially above the projection's surface, and the use of laser grooves to enhance adhesion and prevent resin shrinkage, along with a conductive connection member and sealing resin with specific linear expansion coefficients to secure the components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a projection is added to the die pad frame to improve adhesion with sealing resin, then adhesion is improved, but the conductive connection member may flow into the sealing resin
Solution Approach 1:
The projection is segmented into two functional parts: a base portion that provides adhesion surface for sealing resin, and a locking portion that acts as a barrier against conductive connection member flow. This segmentation allows the single projection structure to simultaneously achieve both adhesion improvement and electrical connection protection.
Solution Approach 2:
Different regions of the projection have different functions: the upper locking portion (above die pad frame surface) prevents conductive member flow, while the lower base portion (at die pad frame surface level) provides adhesion with sealing resin. This local differentiation of quality resolves the contradiction between adhesion and electrical connection reliability.
2Reliability
If the projection extends high above the die pad frame surface to block conductive connection member flow, then electrical connection reliability is improved, but adhesion with sealing resin deteriorates
Solution Approach 1:
The projection is divided into a locking portion extending above the die pad frame surface to block conductive member flow, and a base portion at the surface level that provides sufficient adhesion area for sealing resin. This segmentation ensures both functions are achieved without compromising either.
Solution Approach 2:
The locking portion extends partially above the die pad frame surface (not excessively high) to provide just enough barrier function while maintaining adequate adhesion area. This partial action approach balances the competing requirements of flow blocking and adhesion.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design effectively prevents the flow of conductive connection members and the cracking or separation of sealing resin, ensuring a stable electrical connection and improved adhesion between the semiconductor chip and the die pad frame.
Implementation Method 1
the locking portion has a height that is higher than a height of a top part of the conductive connection member for die pad so as to block a flow of the conductive connection member for die pad
Implementation Method 2
the die pad frame has a projection disposed on the upper surface at an end portion of the die pad frame and protruding from an upper surface of a main body of the die pad frame in a direction that is parallel to the upper surface of the main body of the die pad frame, the projection being intended to improve the adhesion with the sealing resin
Implementation Method 3
a sealing resin for sealing the semiconductor chip, the die pad frame, and the conductive connection member for die pad
Data Source
AI summary
A semiconductor module includes a die pad frame; a semiconductor chip disposed in a chip region on an upper surface of the die pad frame, the semiconductor chip having an upper surface on which a first electrode is disposed and a lower surface on which a second electrode is disposed; a conductive connection member for die pad disposed between the second electrode of the semiconductor chip and the upper surface of the die pad frame, the conductive connection member for die pad electrically connecting the second electrode of the semiconductor chip and the upper surface of the die pad frame; and a sealing resin for sealing the semiconductor chip, the die pad frame, and the conductive connection member for die pad.