Semiconductor Module Inductance Reduction via Direct Solder Bonding

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Solution Overview

Problem

The existing semiconductor module manufacturing processes face challenges in reducing noise generated by inductance in wires, which hinders high-speed communication, and require complex solder ball formation on capacitors and other components, increasing manufacturing complexity and cost.

Innovation Solution

A method involving a semiconductor module with a chip component and a semiconductor device mounted on a printed wiring board, where solder pastes are applied to the board and the chip component is placed such that its electrodes contact the pastes, allowing for direct solder bonding between the chip component and the semiconductor device lands, reducing inductance and simplifying the manufacturing process.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a bypass capacitor is mounted on the printed wiring board using surface mount technology, then the capacitor can be connected to the semiconductor device, but wire inductance increases and noise generation worsens

Engineering Contradiction:

Improvenoise reductionVSAvoidwire inductance

Core Design Contradiction:

ReliabilityVSObject-generated harmful factors

Solution Approach 1:

The patent merges the capacitor mounting process with the semiconductor device mounting process by applying solder paste to both the semiconductor device terminals and capacitor electrodes simultaneously, then heating to melt the solder and directly bond both components to the printed wiring board in a single operation, eliminating the need for separate wire connections

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The patent extracts and eliminates the wire connection element from the traditional capacitor mounting approach, directly bonding the capacitor electrodes to the printed wiring board solder pads through solder melting, thereby removing the source of inductance and noise

Inventive Principle:

Principle #2Taking out (Extraction)

2Reliability

If solder balls are pre-formed on capacitor electrodes before mounting, then direct bonding to the semiconductor device is achieved, but manufacturing complexity and process steps increase

Engineering Contradiction:

Improvebonding strengthVSAvoidmanufacturing process complexity

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The patent applies solder paste to the capacitor electrodes in advance before mounting, so that when the capacitor is placed on the printed wiring board and heated, the pre-applied solder paste melts and forms strong bonds directly between the capacitor electrodes and the board, eliminating the need for separate solder ball formation steps

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The patent makes the solder paste application process universal by using the same solder paste application and heating process for both the semiconductor device terminals and the capacitor electrodes, allowing both components to be mounted and bonded in a single unified process rather than requiring different specialized processes

Inventive Principle:

Principle #6Universality (Multi-functionality)

3Volume of moving object

If the pitch between adjacent terminals in the semiconductor device is narrowed for downsizing, then electronic equipment can be thinned, but manufacturing precision requirements increase

Engineering Contradiction:

Improveelectronic equipment thicknessVSAvoidterminal pitch precision

Core Design Contradiction:

Volume of moving objectVSManufacturing precision

Solution Approach 1:

The patent changes the physical state of the solder from solid paste to molten liquid through heating, allowing the solder to flow and self-align, which compensates for minor positioning variations and enables reliable bonding even with narrowed terminal pitches, thereby supporting equipment downsizing without proportionally increasing precision requirements

Inventive Principle:

Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach reduces noise and increases communication speed by minimizing inductance in the semiconductor device, while simplifying the manufacturing process and improving productivity by eliminating the need for pre-forming solder balls on the capacitor electrodes.

Implementation Method 1

heating and melting the first solder paste and the second solder paste

Methodology Applied

Scientific EffectMelting: Melting

Implementation Method 2

cooling and solidifying wet-spread molten solder

Methodology Applied

Scientific EffectSolidification: Freezing

Implementation Method 3

wet-spread molten solder

Methodology Applied

Scientific EffectWetting: Wetting

Data Source

PatentUS20220102330A1Semiconductor module manufacturing method, electronic equipment manufacturing method, semiconductor module, and electronic equipment

Publication Date: 2022.03.31 CANON KK

AI summary

A chip component including a first electrode and a second electrode, a semiconductor device including a first land and a second land, and a printed wiring board are prepared. A first solder paste and a second solder paste are supplied to the printed wiring board. The chip component is placed on the printed wiring board so that the first electrode is in contact with the first solder paste and the second electrode is in contact with the second solder paste. The semiconductor device is placed on the printed wiring board so that the first land faces the first electrode and the second land faces the second electrode. The solder paste is heated and melted, the first land and the first electrode are bonded to each other, and the second land and the second electrode are bonded to each other.