Semiconductor Module Double-Sided Heat Sink Design
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Solution Overview
Problem
The existing semiconductor modules with a double-sided heat sink structure face challenges in miniaturization and increased thermal resistance due to the need for a heat sink block and wire, which hinder thinning and enhance thermal resistance.
Innovation Solution
The semiconductor module design eliminates the heat sink block and wire by using a first and second heat sink member with a bonding member to connect the semiconductor device directly to the lead frame, allowing for a double-sided heat sink structure without these components, thereby reducing thickness and thermal resistance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of moving object
If a heat sink block and wire are used to connect the semiconductor device to the heat sink, then the structure is more stable and easier to manufacture, but the module thickness increases and thermal resistance increases
Solution Approach 1:
The patent extracts and removes the heat sink block and wire from the traditional semiconductor module structure. By eliminating these intermediate components, the module thickness is reduced and thermal resistance is lowered, while the semiconductor device is directly connected to the heat sink through alternative means that maintain structural stability.
Solution Approach 2:
The patent merges the functions of the heat sink block and wire into a more integrated structure. The lead frame is designed to simultaneously provide mechanical support, electrical connection, and thermal conduction pathways, combining multiple functions into a single component system that reduces overall complexity and thickness.
2Temperature
If a heat sink block and wire are used in the double-sided heat sink structure, then the heat dissipation path is more stable, but the thermal resistance increases and miniaturization is hindered
Solution Approach 1:
The patent removes the heat sink block from the heat dissipation path. By eliminating this intermediate thermal barrier, the thermal resistance is reduced and heat dissipation efficiency is improved, while maintaining reliable thermal conduction through direct contact between the semiconductor device and heat sink members.
Solution Approach 2:
The patent transitions from a traditional linear heat dissipation path (semiconductor → heat sink block → wire → heat sink) to a more direct multi-dimensional thermal conduction structure. The lead frame creates parallel thermal pathways and direct contact surfaces that reduce thermal resistance and improve heat dissipation efficiency.
3Productivity
If the semiconductor device is directly connected to the lead frame without heat sink block, then the module can be miniaturized and thermal resistance reduced, but the manufacturing process becomes more difficult
Solution Approach 1:
The lead frame is designed as a multi-functional component that simultaneously provides mechanical support, electrical connection, and thermal conduction functions. This universal component eliminates the need for separate heat sink blocks and wires, simplifying the manufacturing process while enabling miniaturization and reducing thermal resistance.
Solution Approach 2:
The patent segments the lead frame into multiple functional regions that can be independently optimized and manufactured. The lead frame is divided into support portions, connection portions, and thermal conduction portions, allowing for specialized manufacturing techniques for each segment while maintaining overall integration and simplifying the overall manufacturing process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design achieves miniaturization of the semiconductor module and lowers thermal resistance, reducing manufacturing costs and noise in high-frequency signals while maintaining heat dissipation efficiency.
Implementation Method 1
a bonding member, and a second sealing member... connect the semiconductor device directly to the lead frame... maintaining heat dissipation efficiency
Implementation Method 2
a first heat sink member, a second heat sink member... double-sided heat sink structure... heat dissipation efficiency
Data Source
AI summary
A semiconductor module includes a first heat sink member, a semiconductor device, a second heat sink member, a lead frame, a second sealing member. The semiconductor device includes a semiconductor element, a first sealing member for covering the semiconductor element, a first wiring and a second wiring electrically connected to the semiconductor element, and a rewiring layer on the semiconductor element and the sealing member. The second heat sink member is disposed on the semiconductor device. The lead frame is electrically connected to the semiconductor device through a bonding member. The second sealing member covers a portion of the first heat sink member, the semiconductor and a portion of the second heat sink member. A surface of the second heat sink member faces the semiconductor device. The semiconductor device has a portion protruded from an outline of the second surface sink member.