Semiconductor Module Drive Circuit Integration and Laser Separation

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Solution Overview

Problem

Existing semiconductor modules do not adequately protect the base substrate with a drive circuit during the separation of the growth substrate, leading to potential damage and reduced functionality of the light emitting elements.

Innovation Solution

Incorporating a base substrate with a drive circuit and strategically placing light emitting elements with a distance of 0.1 μm to 20 μm apart, using a semiconductor layer or resin to shield spaces between elements, forming uneven surfaces, or employing a light shielding member to reduce laser damage during the separation process.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If the base substrate is used only for support without drive circuit integration, then the base substrate structure is simple, but the base substrate may be damaged during growth substrate separation and functionality is reduced

Engineering Contradiction:

Improvebase substrate damage resistanceVSAvoidbase substrate configuration

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The patent combines the drive circuit with the base substrate to create an integrated structure. The drive circuit is formed on the base substrate, merging two previously separate components (base substrate and drive circuit) into a single integrated unit, thereby improving reliability without proportionally increasing complexity

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The base substrate is designed to serve multiple functions: mechanical support for light emitting elements, mounting platform for drive circuit, and structural component for heat dissipation. This multi-functionality improves overall system reliability while avoiding the need for additional separate components

Inventive Principle:

Principle #6Universality (Multi-functionality)

2Productivity

If light emitting elements are placed close together to increase density, then productivity increases, but laser damage to base substrate during separation increases

Engineering Contradiction:

Improvelight emitting element densityVSAvoidlaser damage to base substrate

Core Design Contradiction:

ProductivityVSObject-affected harmful factors

Solution Approach 1:

The patent applies different properties to different regions: the spaces between light emitting elements are left open or filled with protective material to allow laser passage or absorption, while the base substrate areas under light emitting elements maintain structural integrity. This localized differentiation allows high density placement while protecting against laser damage

Inventive Principle:

Principle #3Local quality

Solution Approach 2:

The patent introduces an intermediary layer or structure between the light emitting elements and the base substrate that mediates the laser separation process. This intermediary absorbs or redirects the laser energy, preventing direct damage to the base substrate while allowing the separation to proceed

Inventive Principle:

Principle #24Intermediary (Mediator)

3Manufacturing precision

If the growth substrate is separated using laser irradiation, then manufacturing precision is improved, but the base substrate may be damaged by laser exposure

Engineering Contradiction:

Improveseparation precisionVSAvoidlaser damage to base substrate

Core Design Contradiction:

Manufacturing precisionVSObject-affected harmful factors

Solution Approach 1:

The patent converts the potentially harmful laser exposure into a beneficial process by designing the base substrate or associated structures to interact with the laser in a controlled manner. The laser energy is either absorbed by designated regions, reflected away from sensitive areas, or used to trigger beneficial thermal effects that facilitate separation while protecting the base substrate

Inventive Principle:

Principle #22Blessing in disguise (Convert harm into benefit)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The proposed solution effectively reduces damage to the base substrate and enhances the reliability and efficiency of the light emitting elements by minimizing laser exposure and improving light extraction, resulting in improved product quality and performance.

Implementation Method 1

a semiconductor layer that shields a space between the light emitting elements adjacent to each other on an opposite side to the base substrate in a top view

Methodology Applied

Scientific EffectLight absorption: Absorption (EM radiation)

Implementation Method 2

a step of separating off the growth substrate from the plurality of light emitting elements through laser irradiation

Methodology Applied

Scientific EffectLaser heating: Laser

Implementation Method 3

a resin that fills a groove between the light emitting elements adjacent to each other

Methodology Applied

Scientific EffectCapillary action: Capillary Action

Data Source

PatentUS11508708B2Semiconductor module, display apparatus, and semiconductor module manufacturing method

Publication Date: 2022.11.22 SHARP FUKUYAMA LASER CO LTD

AI summary

A semiconductor module includes a ground substrate that is provided with a drive circuit, and a plurality of light emitting elements that are electrically coupled to the drive circuit, in which a distance between the light emitting elements adjacent to each other is equal to or less than 20 μm in a top view.