Semiconductor Module Dual Sealing Elastic Modulus
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Solution Overview
Problem
The existing semiconductor modules do not effectively enhance the strength or longevity of the bonding portion between the front-side electrode of a semiconductor device and the bonding wire, despite using high heat conductivity coatings like copper for heat diffusion.
Innovation Solution
A semiconductor module design that incorporates a first sealing member with a higher elastic modulus than a second sealing member, where the first sealing member covers the bonding portion between the front-side electrode and the bonding wire, and the second sealing member provides additional insulation and protection, using materials such as high glass-transition temperature resins or metallic fillers to maintain elasticity under high temperatures.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a coating layer with high heat conductivity (e.g., copper) is applied to the bonding portion between the bonding wire and front-side electrode, then heat diffusion is improved, but the strength and longevity of the bonding portion are not enhanced
Solution Approach 1:
The patent applies a composite sealing structure consisting of a first sealing member (with higher elastic modulus) and a second sealing member (with lower elastic modulus). This composite sealing structure simultaneously provides mechanical strength to protect the bonding portion and maintains heat diffusion capabilities, resolving the contradiction between heat management and bonding strength.
Solution Approach 2:
The first sealing member is specifically positioned to seal the bonding portion between the bonding wire and front-side electrode, providing localized high elastic modulus support where it is most needed. The second sealing member provides additional sealing with different mechanical properties, creating a locally optimized structure that addresses the specific needs of the bonding region while maintaining overall thermal performance.
2Reliability
If a sealing material is used to seal the bonding portion, then protection is provided, but the elastic modulus may be insufficient to withstand high temperature stress
Solution Approach 1:
The patent employs a composite sealing structure with two distinct sealing members having different elastic moduli. The first sealing member has a higher elastic modulus to provide structural strength and withstand high temperature stress, while the second sealing member has a lower elastic modulus to provide flexible sealing. This composite approach ensures both protection and mechanical strength under high temperature conditions.
Solution Approach 2:
The patent changes the elastic modulus parameter of the sealing material by using different materials for the first and second sealing members. The first sealing member is selected with a higher elastic modulus to maintain structural integrity at high temperatures, while the second sealing member uses a material with lower elastic modulus for flexible sealing, thereby optimizing the sealing structure's performance under thermal stress.
Data Source
AI summary
A semiconductor module includes: a semiconductor device having a front-side electrode; a bonding wire having a bonding portion bonded to the front-side electrode; a first sealing member; and a second sealing member. The first sealing member seals a portion where the front-side electrode and the bonding wire are bonded to each other. The second sealing member covers the first sealing member. The first sealing member is higher than the second sealing member in elastic modulus.