Semiconductor Module Dual-Substrate Stacking for Compact Integration
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Solution Overview
Problem
There is a demand for semiconductor modules with reduced size and weight to meet the requirements of lightweight and compact electronic devices, but existing modules do not efficiently achieve the necessary size and weight standards while maintaining reliability and connectivity.
Innovation Solution
A semiconductor module design featuring a module substrate with a first and second substrate mounted on opposite surfaces, where the substrates include electrical connectors and chips, and a mold layer covers the components to ensure hermetic sealing and reliability, allowing the module to meet international size standards and connect effectively to electronic devices.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the semiconductor module size is reduced to meet lightweight and compact electronic device requirements, then the module can be integrated into smaller devices, but maintaining reliability and connectivity becomes more difficult
Solution Approach 1:
The semiconductor module is divided into distinct functional regions: a first region with a first substrate containing electrical connectors for external device connection, and a second region with a second substrate for internal components. This segmentation allows each region to be optimized independently - the first region meets size standards for connector integration while the second region houses necessary components, thereby maintaining reliability despite overall size reduction
Solution Approach 2:
The patent utilizes vertical stacking of substrates (first substrate and second substrate mounted on opposite surfaces of the module substrate) to reduce the horizontal footprint of the module. By transitioning from a planar layout to a three-dimensional stacked architecture, the module achieves compact size while preserving all necessary functional areas for reliable operation
2Adaptability or versatility
If the semiconductor module meets international size standards for shape and dimensions, then the module can be integrated into standard connectors, but the module design becomes more constrained
Solution Approach 1:
The module substrate serves multiple functions simultaneously: it provides mechanical support for both the first and second substrates, establishes electrical connections between components, defines the overall shape and size to meet international standards, and facilitates integration into standard connectors. This multi-functionality reduces design complexity by consolidating roles that would otherwise require separate components
Data Source
AI summary
In one embodiment, the semiconductor module includes a module substrate and a first substrate mounted on and electrically connected to a first surface of the module substrate. The first substrate has one or more first electrical connectors of the semiconductor module, and the first substrate electrically connecting the first electrical connector to the module substrate.