Semiconductor Module Dummy Terminals Common Mold Alignment

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Solution Overview

Problem

The existing manufacturing processes for semiconductor modules that include multiple types of semiconductor devices with different numbers of terminals are inefficient due to the need for separate molds, leading to issues with resin flow and desired shape retention, making it impossible to produce devices with common molds.

Innovation Solution

A semiconductor module structure where dummy terminals are used to align terminals of different devices, allowing for the use of a common mold by arranging terminals in lines and connecting wires accordingly, with dummy terminals not serving as current pathways but aiding in mold compatibility.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If separate molds are used for manufacturing semiconductor devices with different numbers of terminals, then each device can be manufactured with its desired shape, but manufacturing efficiency decreases and production time increases

Engineering Contradiction:

Improvedesired shape retentionVSAvoidmanufacturing efficiency

Core Design Contradiction:

Manufacturing precisionVSProductivity

Solution Approach 1:

The patent applies universality by designing a single mold that can manufacture both three-terminal semiconductor devices and two-terminal semiconductor devices. The mold includes three terminal receiving grooves that can accommodate different terminal configurations through the use of dummy terminals, allowing one mold to serve multiple manufacturing purposes without sacrificing shape precision or efficiency

Inventive Principle:

Principle #6Universality (Multi-functionality)

Solution Approach 2:

The patent applies preliminary action by introducing dummy terminals during the mold design phase. These dummy terminals are positioned in advance in the mold's terminal receiving grooves to occupy spaces that would otherwise be empty when manufacturing two-terminal devices. This preliminary placement prevents resin flow issues and ensures consistent shape retention across different device types

Inventive Principle:

Principle #10Preliminary action

2Productivity

If a common mold is used for manufacturing semiconductor devices with different numbers of terminals, then manufacturing efficiency improves, but resin flows into empty terminal receiving grooves causing shape defects

Engineering Contradiction:

Improvemanufacturing efficiencyVSAvoidshape retention

Core Design Contradiction:

ProductivityVSManufacturing precision

Solution Approach 1:

The patent converts the harmful effect of empty terminal receiving grooves (which cause resin flow and shape defects) into a beneficial solution by introducing dummy terminals. These dummy terminals serve as placeholders that prevent resin intrusion into empty grooves, transforming the problem of unused grooves into an opportunity for consistent shape retention across different device types

Inventive Principle:

Principle #22Blessing in disguise (Convert harm into benefit)

Solution Approach 2:

The dummy terminals act as intermediaries between the mold's terminal receiving grooves and the resin. They occupy the empty groove spaces and prevent direct resin contact, thereby mediating the interaction between the molding process and the terminal structure to ensure consistent shape retention

Inventive Principle:

Principle #24Intermediary (Mediator)

3Adaptability or versatility

If dummy terminals are added to align terminals of different devices, then a common mold can be used, but device complexity increases

Engineering Contradiction:

Improvemold compatibilityVSAvoidterminal configuration

Core Design Contradiction:

Adaptability or versatilityVSDevice complexity

Solution Approach 1:

The dummy terminals are designed as simple, non-functional elements that serve only their temporary purpose during molding. They are not connected to the semiconductor chip and do not participate in electrical functionality, making them inexpensive and easily removable or ignorable in the final product. This allows mold compatibility without significantly increasing functional device complexity

Inventive Principle:

Principle #27Cheap short-living objects (Disposable)

Data Source

PatentUS10043735B2Semiconductor module, semiconductor device, and method for manufacturing semiconductor devices

Publication Date: 2018.08.07 DENSO CORP

AI summary

A semiconductor module includes: first semiconductor devices; second semiconductor devices; a first and second wires. Each first semiconductor device comprises: first sealing resin; first-third terminals; a first semiconductor chip connected to the first and third terminals. Each second semiconductor device comprises: second sealing resin; fourth-sixth terminals; a second semiconductor chip connected to the fourth and fifth terminals, and not connected to the sixth terminal. The first and second semiconductor devices are stacked along a stacking direction. The first terminals and the fourth terminals are arranged in a line along the stacking direction. The second terminals and the fifth terminals are arranged in a line along the stacking direction. The third terminals and the sixth terminals are arranged in a line along the stacking direction. The first wire is connected to the fifth terminals. The second wire is connected to the third terminals.