Semiconductor Module With Embedded Die In Encapsulant Opening
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Solution Overview
Problem
The complexity and cost of packaging semiconductor devices, particularly in vertical stacking configurations, limit flexibility and increase expenses due to the need for intricate electrical connections and space-efficient designs in limited spaces.
Innovation Solution
A semiconductor module design that incorporates a first semiconductor package with an opening in its encapsulant, allowing a second semiconductor die to be partially or fully embedded within, utilizing clips and adhesive layers for interconnects, and a secondary encapsulating material to fill the opening, thereby reducing package thickness and enhancing space utilization.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If vertically stacked packages are used to save space, then space utilization improves, but device complexity and packaging cost increase
Solution Approach 1:
The patent embeds a second semiconductor package within an opening of the first semiconductor package's encapsulant. The second package is partially or fully contained within the first package's encapsulating material, creating a nested configuration that saves PCB space while avoiding the complexity of traditional vertical stacking with separate packages and interconnects.
Solution Approach 2:
The patent combines multiple semiconductor packages into a single integrated structure by placing the second package within the first package's encapsulant. This merging approach consolidates what would traditionally be separate packaged components into one unified package, reducing overall complexity and space requirements.
2Area of stationary object
If vertically stacked dies within a single package are used, then space utilization improves, but manufacturing cost increases due to complex packaging process
Solution Approach 1:
The patent forms the opening in the first encapsulant after the first die is already packaged and encapsulated. This preliminary packaging of the first die simplifies the overall process compared to attempting to stack dies during the initial packaging process, as the opening can be created using standard encapsulation materials and processes.
Solution Approach 2:
The patent divides the packaging process into separate stages: first packaging the first die in its own encapsulant, then forming an opening, and finally placing the second die within that opening. This segmentation allows each die to be packaged independently using standard processes, avoiding the need for complex simultaneous multi-die packaging.
3Reliability
If traditional packaging with multiple external connections is used, then electrical connection reliability improves, but package thickness increases
Solution Approach 1:
By nesting the second package within the first package's encapsulant, the patent reduces the overall package thickness compared to vertical stacking where packages would be placed one on top of another with full interconnect structures. The nested configuration allows shared encapsulation and reduced external connection requirements.
Data Source
AI summary
In accordance with an embodiment of the present invention, a semiconductor module includes a first semiconductor package having a first semiconductor die, which is disposed in a first encapsulant. An opening is disposed in the first encapsulant. A second semiconductor package including a second semiconductor die is disposed in a second encapsulant. The second semiconductor package is disposed at least partially within the opening in the first encapsulant.