Semiconductor Module Layout for Fan Cooling and Compact Packaging
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Solution Overview
Problem
In semiconductor devices with a fan and semiconductor module, the heated air flow from heat-generating components can inefficiently cool other components, leading to increased size and cost due to the need for wider clearances or higher-cost components with higher heat resistance.
Innovation Solution
The semiconductor device configures the fan device downstream of both the first element with higher heat generation and the second element with lower heat generation, allowing the second element to be closer to the first element and using an inexpensive second element, while ensuring effective cooling by directing the air flow to cool the first element after passing through the second element.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If the heat generating device is located on the upstream side and other devices are located on the downstream side in the air flow direction, then the other devices can be cooled by the air flow, but a wide clearance must be secured from the heat generating device which causes an increase in device size
Solution Approach 1:
The patent inverts the conventional arrangement by placing the heat generating device downstream and other devices upstream in the air flow direction. This allows the air flow to cool the other devices first before passing over the heat generating device, eliminating the need for wide clearance while maintaining cooling performance.
Solution Approach 2:
The patent applies different spatial arrangements to different devices based on their heat generation characteristics. Low heat generation devices are positioned upstream where they benefit from cooler air, while the high heat generation device is positioned downstream where it can tolerate warmer air, optimizing both cooling efficiency and space utilization.
2Volume of moving object
If the clearance from the heat generating device is reduced to avoid increase in size, then device size is reduced, but expensive elements having high heat resistance must be adopted which causes an increase in cost
Solution Approach 1:
By inverting the device arrangement, the patent enables smaller clearances without compromising cooling performance. This eliminates the need for expensive high heat resistance elements, thereby reducing manufacturing costs while maintaining compact device size.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively cools each element on the module board without increasing size or cost, by minimizing the influence of heated air on lower heat resistance components and ensuring efficient cooling performance.
Implementation Method 1
a fan device for generating an air flow by driving
Implementation Method 2
the air flow heated by heat exchange with the heat generating device
Data Source
AI summary
A semiconductor device (1) includes a semiconductor module (20) and a fan device (30). The semiconductor module (20) includes a module board (21), a first element (22) mounted on the module board (21), and a second element (23a) having a smaller heat generation amount and lower heat resistance. In a flowing direction of an air flow (F) formed by driving the fan device (30), the fan device (30) is disposed downstream of the first element (22) and the second element (23a), and the first element (22) is disposed downstream of the second element (23a).