Power Semiconductor Module Fastening Reinforcement
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional power semiconductor modules face challenges in effectively managing thermal stress and enhancing the structural integrity of fastening portions, leading to potential deformation and reduced lifespan under varying thermal conditions and mechanical loads.
Innovation Solution
The power semiconductor module incorporates reinforcing portions made of insulating materials, such as polyphenylene sulfide, which are integrated with the terminal case and extend outward to reinforce fastening portions, improving their strength and resilience against thermal and mechanical stresses without increasing the thickness of the cooling apparatus components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If conventional cooling apparatus components are used without reinforcing portions, then the device complexity is low, but the strength of fastening portions deteriorates under thermal and mechanical stresses
Solution Approach 1:
The terminal case is divided into a case body and separate reinforcing portions. These reinforcing portions are positioned at specific locations (corner portions and edge portions) to locally strengthen the fastening portions without requiring the entire structure to be more complex. The segmentation allows targeted reinforcement where thermal and mechanical stresses are most concentrated.
Solution Approach 2:
The reinforcing portions are made from insulating material that may differ from the case body material. This composite approach allows the reinforcing portions to provide both mechanical strength enhancement and electrical insulation, while the material properties can be optimized independently for each component based on specific performance requirements.
2Strength
If the thickness of cooling apparatus components is increased to enhance strength, then the strength of fastening portions improves, but the volume of the cooling apparatus increases
Solution Approach 1:
Instead of uniformly increasing the thickness of the entire cooling apparatus, reinforcing portions are strategically placed only at the fastening portions where strength is most needed. This local quality approach concentrates material where it provides maximum benefit while keeping the overall volume minimal. The reinforcing portions extend from corner portions and edge portions of the case body to specifically reinforce fastening locations.
3Reliability
If reinforcing portions are added to the terminal case, then the reliability under thermal stress improves, but the device complexity increases
Solution Approach 1:
The reinforcing portions are integrated with the case body to form an integrated terminal case structure. This merging combines the structural support function of the case body with the reinforcement function of the reinforcing portions into a unified component. The integration allows the reinforcing portions to work synergistically with the case body to resist thermal expansion and mechanical stresses, improving reliability without requiring separate independent reinforcement systems.
Data Source
AI summary
A power semiconductor module including a cooling apparatus and a power semiconductor device mounted on the cooling apparatus, wherein the cooling apparatus includes: a ceiling plate that; a case; and a cooling fin, a ceiling plate and the case respectively include fastening portions that are used to fasten the ceiling plate and the case to an external apparatus, while the ceiling plate and the outer edge portion are arranged in an overlapping manner, the power semiconductor device includes a circuit substrate and a terminal case, the fastening portions protrude farther outward than a periphery of the ceiling plate, and the terminal case includes a case body arranged along a perimeter of the circuit substrate and reinforcing portions that extend to top surface sides of the fastening portions.