Semiconductor Module Unit With Flexible Board Fitting
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Solution Overview
Problem
Conventional semiconductor module units face challenges in assembling workability and noise reduction due to the complexity of connecting semiconductor modules with control boards, often requiring soldering and resulting in increased inductance components that cause noise issues.
Innovation Solution
A semiconductor module unit design featuring a control board with a main board, a sub board, and a flexible board that electrically connects them, where the sub board includes a fitting part with a projecting or recessed-projecting shape to securely fit into a corresponding recessed portion on the semiconductor module, allowing for direct electrical connection and reducing the need for external connectors or wires, thus improving workability and minimizing noise.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the semiconductor module and control board are electrically connected by soldering, then reliable electrical connection is achieved, but assembling workability deteriorates
Solution Approach 1:
A flexible board is introduced as an intermediary component between the semiconductor module and control board. The flexible board includes a fitting part that fits into a fitting groove on the semiconductor module, establishing electrical connection through contact with a contact electrode, thereby eliminating the need for soldering while maintaining reliable electrical connection.
Solution Approach 2:
The soldering process (thermal-mechanical connection method) is replaced with a mechanical fitting system. The fitting part of the flexible board is inserted into the fitting groove and held by elastic force from a resilient member, creating a reliable electrical connection through mechanical contact rather than soldering.
2Ease of operation
If the distance between the semiconductor module and control board is increased to improve assembling workability, then assembling operability is improved, but inductance components increase causing noise
Solution Approach 1:
The control board is divided into a main board and a sub board, with the driver circuit mounted on the sub board. The sub board is positioned close to the semiconductor module through the fitting part mechanism, keeping the electrical connection distance short and minimizing inductance, while the main board can be positioned separately for operator accessibility during assembly.
3Ease of manufacture
If a flexible board is used to connect the main board and sub board, then assembling flexibility is improved, but device complexity increases
Solution Approach 1:
The fitting part is integrated directly into the flexible board structure, combining the connection function and electrical contact function into a single component. This reduces the number of separate parts needed and simplifies the overall assembly process despite the added flexibility of the flexible board.
Data Source
AI summary
A semiconductor module unit includes a semiconductor module, and a control board that includes a driver circuit configured to output drive signals to the semiconductor module and controls the semiconductor module. The control board includes a main board, a sub board that is separated from the main board and on which the driver circuit is mounted, and a flexible board that has flexibility and electrically connects the main board and the sub board. The sub board includes a fitting part that is fitted in a fitted part of the semiconductor module. The semiconductor module is electrically connected to the driver circuit in a state where the fitting part is fitted in the fitted part.