Semiconductor Module Layout With Floating Wiring for Heat Dissipation
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Solution Overview
Problem
Conventional semiconductor modules face challenges in enhancing heat dissipation as they increase in current, integration, and reduce in size, necessitating improved thermal management beyond existing cooling structures.
Innovation Solution
A semiconductor module configuration that includes an insulating substrate with formed wiring, a semiconductor chip connected to both the wiring and a lead frame, where the lead frame is connected to a floating wiring at the corner of the substrate, enhancing heat dissipation through additional paths without interfering with existing heat dissipation mechanisms.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional cooling structures are used with existing wiring configurations, then the module structure is simple, but heat dissipation performance is insufficient for high current and high integration applications
Solution Approach 1:
The wiring is divided into functional wiring for electrical connection and floating wiring dedicated to heat dissipation. This segmentation allows the heat dissipation function to be independently optimized through the floating wiring that extends to the cooling structure, without interfering with the electrical functionality of the functional wiring.
Solution Approach 2:
The floating wiring serves multiple functions: it acts as a thermal conduction path from the lead frame to the cooling structure, and simultaneously functions as a structural element that enhances the overall thermal management system. This multi-functionality improves heat dissipation without adding separate dedicated components.
2Volume of moving object
If the module size is reduced to improve integration, then miniaturization is achieved, but heat dissipation capability deteriorates
Solution Approach 1:
The floating wiring extends in the vertical dimension from the lead frame through the insulating substrate to the cooling structure. This three-dimensional thermal path allows efficient heat dissipation without increasing the planar footprint, enabling improved heat management in miniaturized modules.
3Ease of manufacture
If adhesive with large thermal resistance is used to fix the cooling structure, then assembly is simplified, but cooling performance decreases
Solution Approach 1:
The floating wiring itself serves as the thermal conduction path that directly connects the lead frame to the cooling structure, eliminating the need for adhesive layers. The wiring's inherent thermal conductivity provides the heat dissipation function, making the system self-sufficient for thermal management without requiring additional materials that would introduce thermal resistance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration significantly enhances the heat dissipation effect by adding new heat dissipation paths that conduct heat from the lead frames to floating wirings and the insulating substrate, improving thermal management and balancing thermal resistance and fatigue resistance.
Implementation Method 1
a connection point between the floating wiring and the lead frame is located at a corner part of the insulating substrate... adding new heat dissipation paths that conduct heat from the lead frames to floating wirings and the insulating substrate
Data Source
AI summary
Provided is a semiconductor module comprising a semiconductor chip, a wire formed on an insulating substrate, and a lead frame, the semiconductor module having a higher heat-dissipating effect than before. A semiconductor module 10 of the present invention comprises an insulating substrate 1, a wire 2 formed on the insulating substrate 1, a semiconductor chip 3, and a lead frame 4, and is characterized in that the semiconductor chip 3 has one surface connected to the wire 2 and another surface connected to the lead frame 4, the wire 2 has a floating wire to which the lead frame 4 is connected, and a connection point between the floating wire and the lead frame 4 is located at a corner of the insulating substrate 1.