Power Semiconductor Module Barrier Layer Against Corrosive Gas Diffusion
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Solution Overview
Problem
Power semiconductor modules are vulnerable to corrosion from gases like sulfur-containing compounds, leading to chemical degradation and failure, as existing protective measures are not fully effective in preventing gas penetration.
Innovation Solution
A method involving the deposition of an inorganic filler impermeable to corrosive gases within the housing, followed by filling and hardening with casting material to form a protective layer that prevents gas diffusion, creating a long diffusion path for gases and enhancing module longevity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the housing is made permeable to gases, then gas diffusion is allowed, but corrosive gases can penetrate and cause chemical degradation of metallic components
Solution Approach 1:
The patent applies composite materials by combining inorganic filler particles (such as aluminum oxide, aluminum nitride, or silicon carbide) with organic binder material to form a protective layer. This composite structure creates a dense, impermeable barrier that prevents corrosive gases from reaching metallic components while maintaining structural integrity and chemical stability.
Solution Approach 2:
The inorganic filler material creates an inert protective environment by forming a chemically stable layer that does not react with corrosive gases. This inert barrier prevents harmful chemical interactions between external gases and the metallic components inside the housing, effectively isolating sensitive elements from degradation.
2Object-affected harmful factors
If a protective layer is formed using only inorganic filler, then gas impermeability is achieved, but spaces between filler particles remain that could allow gas diffusion
Solution Approach 1:
The organic binder material serves as an intermediary substance that fills the voids and spaces between inorganic filler particles. This binder creates continuous bonding between particles, eliminating gaps that could serve as diffusion pathways for gases, and forms a unified impermeable protective layer with enhanced structural coherence.
3Ease of manufacture
If the protective layer is made entirely of organic binder material, then ease of application is improved, but gas impermeability and chemical stability are insufficient
Solution Approach 1:
The protective layer combines the advantages of both inorganic and organic materials: inorganic filler particles provide chemical stability, gas impermeability, and structural rigidity, while the organic binder material ensures ease of application, adhesion to substrates, and flexibility in forming continuous protective coatings through conventional manufacturing processes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively protects semiconductor components from corrosive gases, significantly increasing the lifetime of power semiconductor modules by preventing chemical degradation and ensuring reliable operation.
Implementation Method 1
forming a pre-layer by depositing inorganic filler on a first surface within a housing
Implementation Method 2
filling casting material into the housing, thereby filling any spaces present in the inorganic filler of the pre-layer with the casting material, and hardening the casting material
Data Source
AI summary
A power semiconductor module arrangement includes: a substrate arranged within a housing; at least one semiconductor body arranged on a top surface of the substrate; and a first layer arranged on a first surface within the housing. The first layer includes inorganic filler which is impermeable to corrosive gases and a casting material which fills spaces present in the inorganic filler.