Power Semiconductor Module Protective Layer for Corrosive Gases
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Solution Overview
Problem
Power semiconductor module arrangements are vulnerable to corrosion from gases such as sulfur-containing compounds, which can lead to chemical degradation of components and module failure.
Innovation Solution
A power semiconductor module design that incorporates a second protective layer with a reactant material distributed within a dielectric material, which chemically reacts with corrosive gases to prevent them from reaching the module components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the housing is made permeable to gases, then ease of manufacture is improved, but corrosion protection deteriorates
Solution Approach 1:
A protective layer is introduced as an intermediary between the housing interior and the corrosive environment. This protective layer contains a reactant that chemically reacts with corrosive gases (such as sulfur-containing gases) to form a stable compound, thereby preventing the gases from reaching and corroding the semiconductor components and electrical connections inside the housing.
Solution Approach 2:
The harmful corrosive gases are converted into a beneficial protective mechanism through chemical reaction. The reactant in the protective layer reacts with the corrosive gases to form stable compounds, transforming the harmful corrosive action into a protective chemical barrier that prevents further degradation of the module components.
2Object-affected harmful factors
If a protective layer with reactant is added, then corrosion protection is improved, but device complexity increases
Solution Approach 1:
The protective function and the structural housing are merged into a single integrated component. The protective layer is applied directly to the interior surface of the housing, combining the housing's mechanical protection function with the protective layer's chemical corrosion protection function, thereby avoiding the need for separate protective components.
Solution Approach 2:
The housing is given multiple functions: it provides mechanical protection, structural support, and chemical corrosion protection through the integrated protective layer. The protective layer serves both as a physical barrier and as a chemical reactant reservoir, enabling the housing to protect against multiple types of degradation simultaneously.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively protects semiconductor components from corrosion, thereby increasing the overall lifetime of the power semiconductor module by preventing chemical degradation from corrosive gases.
Implementation Method 1
A protective layer is arranged on an outer side of the semiconductor substrate, wherein the protective layer comprises a reactant configured to chemically react with the corrosive gases
Data Source
Figure 1~2
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Figure 5~6
AI summary
A power semiconductor module arrangement (100) includes a semiconductor substrate (10) arranged within a housing (7), the housing (7) comprising sidewalls, at least one semiconductor body (20) arranged on a top surface of the semiconductor substrate (10), a first protective layer (5) arranged on the top surface of the semiconductor substrate (10), thereby covering the at least one semiconductor body (20), a second protective layer (6) for protecting the power semiconductor module arrangement (100), and a seal (8). The second protective layer (6) comprises a first material and a second material (61), wherein the second material (61) is distributed within the first material and comprises a reactant, wherein the reactant is configured to chemically react with, trap, adsorb, or absorb corrosive gases. The second protective layer (6) covers at least a top surface of the first protective layer (5), wherein a top surface of the first protective layer (5) is a surface facing away from the semiconductor substrate (10). The seal (8) is arranged between the sidewalls of the housing (7) and the semiconductor substrate (10) and comprises a third material and a fourth material (62), wherein the fourth material (62) is distributed within the third material and comprises a reactant, wherein the reactant is configured to chemically react with, trap, adsorb, or absorb corrosive gases.