Power Semiconductor Module Shielding Layout for Gate Noise Stability

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Solution Overview

Problem

The increasing output voltage in electric power conversion apparatuses leads to higher radiated noise from the collector and source electrodes, which can cause significant variations in the lower gate voltage, resulting in operational failures such as malfunctions in the module elements.

Innovation Solution

A power semiconductor module with a heat sink featuring a shielding layer and through holes, where only the control line parts extend to the rear surface, shielding the power line parts from radiated noise, thereby reducing noise propagation and stabilizing the control signal.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Power

If the output voltage is increased to meet higher power conversion requirements, then the power transmission capability is improved, but the radiated noise from power lines increases and causes gate voltage variation leading to operational failures

Engineering Contradiction:
Improveoutput voltageVSAvoidoperational stability
Core Design Contradiction:
PowerVSReliability

Solution Approach 1:

The patent divides the module into distinct functional regions: a front surface for power lines and a rear surface for control lines, separated by a partition wall. This spatial segmentation prevents radiated noise from power lines from affecting control lines, thereby maintaining operational stability while allowing high output voltage operation.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent applies different material properties to different regions: the partition wall is made of magnetically permeable material (such as ferrite) specifically in the region where control lines pass through, while other structural components use conventional materials. This localized application of magnetic shielding properties protects control signals without compromising overall power transmission capability.

Inventive Principle:
Principle #3Local quality

2Ease of operation

If all lines (power and control) are extended to the rear surface for external connection, then the ease of connection is improved, but the control lines are exposed to radiated noise from power lines

Engineering Contradiction:
Improveconnection convenienceVSAvoidradiated noise interference
Core Design Contradiction:
Ease of operationVSObject-affected harmful factors

Solution Approach 1:

The partition wall creates separate pathways: power lines extend to the rear surface through one region while control lines extend through another region. This segmentation allows both types of lines to be conveniently connected externally while preventing electromagnetic interference between them through the partition structure.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The partition wall acts as an intermediary barrier between power lines and control lines. By introducing this intermediate structure with magnetic shielding properties, the patent enables both lines to access the rear surface for connection while the partition wall mediates and blocks the harmful radiated noise from reaching the control lines.

Inventive Principle:
Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution effectively suppresses operational failures by minimizing noise interference between the power and control lines, ensuring stable control signals and reducing the risk of malfunctions.

Implementation Method 1

The heat sink includes a shielding layer formed from a material having at least one of electrical conductivity and magnetism

Methodology Applied
Scientific EffectElectromagnetic shielding: Faraday Cage

Implementation Method 2

a heat sink including a front surface on which the power semiconductor element is installed and a rear surface opposite the front surface, and capable of dissipating heat from the power semiconductor element

Methodology Applied
Scientific EffectHeat dissipation: Heat Sink

Data Source

PatentEP4618398A1Power semiconductor module and electric power conversion apparatus
Publication Date: 2025.09.17 IHI CORP
  • EP4618398A1 patent drawingFigure 1
  • EP4618398A1 patent drawingFigure 2
  • EP4618398A1 patent drawingFigure 3

AI summary

A power semiconductor module includes: a power semiconductor element configured to switch conduction and non-conduction between a first electrode and a second electrode according to a control signal applied to a control electrode; a heat sink capable of dissipating heat from the power semiconductor element; a first power line part and a second power line part configured to transmit electric power between the first electrode and the second electrode; a first control line part configured to apply the control signal to the control electrode; and a second control line part configured to provide a reference potential of the control signal. The heat sink includes a shielding layer formed from a material having at least one of electrical conductivity and magnetism. The heat sink includes at least one through hole passing from a front surface to a rear surface. Only the first control line part and the second control line part among the first power line part, the second power line part, the first control line part, and the second control line part extend to a region on the rear surface of the heat sink through the through hole.