Semiconductor Module Heat Conduction Structure to Prevent Grease Pump-Out
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Solution Overview
Problem
Existing semiconductor modules face issues with grease outflow or pump-out due to warpage and uneven contact surfaces, leading to increased thermal resistance and higher costs associated with viscosity optimization for varying temperature and environmental conditions.
Innovation Solution
A semiconductor module design featuring a heat conduction section with a frame and opening, where a semisolid grease is partly filled in the opening and a band-shaped space portion is provided between the grease and frame to accommodate any outflow, ensuring efficient heat dissipation and preventing grease pump-out, with a Young's modulus and viscosity range that adapts to deformation and warpage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If grease is used to fill the contact surface between the multilayer substrate and the cooler, then heat dissipation performance is improved, but grease outflow or pump-out occurs during reliability tests and actual use
Solution Approach 1:
The opening is divided into a grease portion for heat conduction and a space portion to accommodate grease movement, preventing pump-out while maintaining thermal contact
Solution Approach 2:
The grease portion is positioned partially within the opening rather than filling it completely, creating a three-dimensional arrangement where grease can move into the space portion without losing thermal contact functionality
2Adaptability or versatility
If the contact surface between the multilayer substrate and the cooler is made uneven to accommodate warpage, then adaptability to deformation is improved, but air layers with low thermal conductivity are formed
Solution Approach 1:
Grease is introduced as an intermediary substance that fills the gaps and air layers formed by uneven contact surfaces, providing continuous thermal conduction paths while accommodating substrate warpage
3Reliability
If high viscosity grease is used to prevent pump-out, then grease stability is improved, but additional steps for mixing and evaporation are required
Solution Approach 1:
The patent uses conventional grease without requiring special high-viscosity formulations, avoiding the need for additional mixing and evaporation steps while still preventing pump-out through the structural design of the opening with dedicated space portion
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design effectively maintains high heat dissipation performance while preventing grease outflow and pump-out, ensuring reliable thermal conductivity and reducing thermal resistance across varying operating conditions.
Implementation Method 1
the heat generated in the semiconductor device is conducted to the cooler through the heat conduction section
Implementation Method 2
the grease of the grease portion is semisolid, so that the outflow or pump-out phenomenon of the grease occurs due to gravity
Data Source
AI summary
A semiconductor module has a heat conduction section provided between a multilayer substrate, on which semiconductor chips are mounted, and a cooler. The heat conduction section includes a frame and an opening, and the opening has a grease portion which is provided partly in the opening and is in contact with the multilayer substrate and the cooler, and a space portion which is provided between the grease portion and the frame in a partial and band-shaped manner.