Semiconductor Module Testing with Data-Matched Gripper Loading
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Solution Overview
Problem
The increasing complexity of semiconductor devices complicates the testing process, requiring varied test environments that depend on the board, test program, and semiconductor module, leading to inefficiencies in loading operations.
Innovation Solution
A test device and method that automates the loading of semiconductor modules by using a processor to match test and board data, simulate loading conditions, select target slots, and control a gripper with multiple hands to load the modules efficiently, adapting to various board types and test programs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If manual loading operation is used, then flexibility in handling various board types is maintained, but time consumption and labor cost increase
Solution Approach 1:
The system performs self-identification by automatically reading board type information and module specifications through sensors and databases, eliminating the need for manual configuration. The automation device independently determines loading parameters and executes operations without continuous human intervention, achieving self-service functionality that improves productivity while managing complexity through autonomous decision-making algorithms.
Solution Approach 2:
The loading device is designed with universal capabilities to handle multiple board types and semiconductor module configurations through a single automated system. By integrating database storage for various board specifications and programmable control logic, the device can adapt to different loading scenarios without requiring separate manual procedures, thereby improving overall productivity while consolidating functionality into one multi-purpose system.
2Productivity
If automation device is introduced, then loading efficiency is improved, but initial investment and system complexity increase
Solution Approach 1:
The automated loading system is divided into functional modules including board type detection units, database query modules, gripper control sections, and positioning mechanisms. Each module performs a specific function and can be independently optimized or replaced, reducing overall system complexity and implementation cost while maintaining high loading efficiency through coordinated operation of segmented components.
Solution Approach 2:
Manual mechanical loading operations are replaced with automated control systems that use sensors, databases, and programmable logic to determine loading parameters. The system substitutes human decision-making with electronic information processing, replacing complex manual judgment with database-driven automated selection of loading positions and methods, thereby improving efficiency while reducing the need for expensive custom mechanical designs.
3Adaptability or versatility
If standardized loading process is used, then process simplicity is maintained, but adaptability to different board types decreases
Solution Approach 1:
A database serves as an intermediary between the physical board variations and the automated loading process. The database stores standardized information about different board types, slot configurations, and module specifications, allowing the system to query and retrieve appropriate loading parameters without requiring complex physical adaptations. This intermediary layer enables high adaptability while maintaining process simplicity through centralized information management.
Solution Approach 2:
Board type information and loading parameters are pre-stored in the database before the actual loading operation. The system performs preliminary identification of the board type and retrieves the corresponding loading configuration in advance, allowing the automated device to execute the loading process using pre-determined parameters. This preliminary action reduces real-time decision complexity while maintaining adaptability to various board types through pre-configured data.
Data Source
AI summary
A method includes receiving test information, matching test program data and board data stored in a database to the test information, simulating loading of the semiconductor module based on a result of the matching, selecting at least one target slot from among slots of a board based on a result of the simulating, picking the semiconductor module to correspond to the number of at least one target slot using a plurality of hands of a gripper, and loading the semiconductor module to at least one target slot of the board.