Semiconductor Module Linear Guide Portion Solder Wetting Control
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Solution Overview
Problem
Conventional methods using oxide films to suppress solder wetting-spread in semiconductor modules are ineffective in preventing excessive solder flow, leading to interference with wire bonding areas and potential failures.
Innovation Solution
A semiconductor module design featuring a metal plate with linear guide portions of increased surface roughness, created by laser irradiation, which inhibits oxide film formation and guides solder flow to prevent excessive spreading, ensuring accurate fillet shape and electrical connections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If oxide film is used to suppress solder wetting-spread, then solder spread is partially reduced, but excessive wetting-spread is not completely suppressed
Solution Approach 1:
The invention creates linear guide portions with locally increased surface roughness on the metal plate, while maintaining smooth peripheral regions. This localized surface modification directs solder flow along the rough linear portions without completely blocking wetting, thereby preventing excessive spread while ensuring reliable connections.
Solution Approach 2:
The invention changes the surface roughness parameter of the metal plate by laser irradiation to create linear guide portions. This parameter change directs solder flow behavior, converting uncontrolled excessive wetting-spread into controlled flow along predetermined paths, thus preventing failures.
2Object-affected harmful factors
If conventional oxide film method is used, then some solder spread suppression is achieved, but interference with wire bonding area occurs
Solution Approach 1:
The invention segments the metal plate surface into linear guide portions with increased roughness and smooth peripheral regions. This segmentation creates controlled flow paths that direct solder away from wire bonding areas, preventing interference while maintaining effective spread suppression.
3Shape
If laser irradiation is applied to create linear guide portions, then surface roughness is increased to guide solder flow, but oxide film formation is inhibited
Solution Approach 1:
The invention replaces chemical oxide film formation with physical laser surface modification. Laser irradiation directly alters the surface morphology to create rough linear guide portions, substituting the chemical mechanism (oxide formation) with a physical mechanism (laser ablation/melting), thereby achieving surface roughness enhancement without relying on oxide films.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively suppresses excessive solder wetting-spread, preventing failures such as short circuits and ensuring uniform solder thickness, thereby enhancing the quality and reliability of semiconductor modules.
Implementation Method 1
irradiating a circumference of a soldering-scheduled region on a top surface of a metal plate with a laser light to delineate a linear guide portion
Implementation Method 2
trapping, on a surface of the guide portion, the solder flowing outward from the component-to-be-bonded
Data Source
AI summary
A semiconductor module includes a metal plate; a solder applied on the metal plate; a component-to-be-bonded mounted on the solder; and a linear guide portion delineated along a circumference of the component-to-be-bonded on a top surface of the metal plate, and including a metal surface having greater surface roughness than a peripheral region.