Power Semiconductor Module Heat Dissipation Plate with Fins
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Solution Overview
Problem
Existing power semiconductor devices face poor heat dissipation efficiency, especially when used in liquid cooling environments due to bypass flow issues, as they typically have small heat dissipation surfaces or heat sinks exposed on one side.
Innovation Solution
A structure featuring a heat dissipation plate with protruding fins and wall portions that form a waterway structure, where the heat dissipation plate is thermally connected to a heating element and sealed with resin, allowing for efficient water flow guidance and suppression of bypass flow.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If a flat heat dissipation surface is formed, then the structure is simple, but the surface area is small and heat exchange efficiency is poor
Solution Approach 1:
The invention transitions from a flat two-dimensional heat dissipation surface to a three-dimensional structure with fins protruding in multiple directions. The fin portions extend vertically and laterally, creating a multi-dimensional heat dissipation architecture that dramatically increases the effective surface area for heat exchange while maintaining a compact footprint.
Solution Approach 2:
The heat dissipation plate is segmented into multiple fin portions that are separated and distributed across the plate surface. Each fin acts as an independent heat dissipation element, collectively providing a large total surface area. This segmentation allows the heat dissipation function to be distributed throughout the structure rather than concentrated in a single flat plane.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances heat dissipation efficiency while minimizing pressure loss, allowing for effective cooling of power semiconductor devices in liquid cooling systems.
Implementation Method 1
a heat dissipation plate thermally connected to a heating element
Implementation Method 2
a waterway structure having a flat wall surface and having the structure inserted therein... a water flow can be efficiently guided and high dissipation can be realized
Data Source
AI summary
An object of the present invention is to provide a structure, particularly, a power semiconductor module, which suppresses a bypass flow of a cooling medium and improves cooling efficiency. A structure according to the present invention includes a heat dissipation plate thermally connected to a heating element, and a resin region having a resin material that fixes the heating element and the heat dissipation plate, wherein the heat dissipation plate includes a fin portion including a plurality of fins protruding from a heat dissipation surface of the heat dissipation plate and formed to be exposed from the sealing resin material, and a wall portion formed to protrude from the heat dissipation surface to a same side as the fin and which separates the fin portion and the resin region.