Semiconductor Module Base Structure for Shorter Heat Transfer Paths

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Solution Overview

Problem

The existing semiconductor module design has a long heat transfer path due to a stepped portion between the mounting surface and cooling fins, which hinders effective heat dissipation from the semiconductor device to the cooling water.

Innovation Solution

A semiconductor module with a refrigerant jacket and a base configuration where the semiconductor element is positioned closer to the refrigerant passage, featuring a recess and fin protrusions on the base to enhance heat dissipation directly to the refrigerant.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Strength

If a stepped portion is formed between the mounting surface and cooling fins, then the structural support and fin positioning are improved, but the heat transfer path length increases and heat dissipation efficiency deteriorates

Engineering Contradiction:

Improvestructural supportVSAvoidheat dissipation efficiency

Core Design Contradiction:

StrengthVSTemperature

Solution Approach 1:

The invention extracts the stepped portion from the base structure, eliminating the intermediate step that caused the long heat transfer path. The cooling fin is positioned directly on the mounting surface without requiring a stepped portion for support, thus removing the harmful structural element while maintaining structural integrity through direct mounting.

Inventive Principle:

Principle #2Taking out (Extraction)

Solution Approach 2:

Instead of creating a stepped portion to position the cooling fin, the invention inverts the approach by having the cooling fin extend directly from the mounting surface into the refrigerant passage. The positioning is achieved through the fin's own geometry and the refrigerant passage configuration rather than through a stepped base structure.

Inventive Principle:

Principle #13The other way round (Inversion)

2Device complexity

If the stepped portion is used to position cooling fins, then the fin arrangement is simplified, but the heat transfer path becomes long and cooling performance decreases

Engineering Contradiction:

Improvefin arrangement complexityVSAvoidcooling performance

Core Design Contradiction:

Device complexityVSProductivity

Solution Approach 1:

The stepped portion is completely removed from the base design. The cooling fin is positioned directly on the mounting surface, eliminating the need for the stepped structure while maintaining simple fin arrangement through direct extension into the refrigerant passage.

Inventive Principle:

Principle #2Taking out (Extraction)

Solution Approach 2:

The cooling fin extends in multiple dimensions: it has a mounting surface contact area, extends vertically into the refrigerant passage, and may have lateral extensions. This multi-dimensional configuration achieves effective cooling without requiring a stepped portion, utilizing spatial optimization rather than vertical stacking.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

3Device complexity

If the semiconductor element is positioned farther from the refrigerant passage, then the base structure is simplified, but the heat transfer efficiency to refrigerant is reduced

Engineering Contradiction:

Improvebase structure simplicityVSAvoidheat transfer efficiency

Core Design Contradiction:

Device complexityVSTemperature

Solution Approach 1:

The stepped portion that created distance between the semiconductor element and refrigerant passage is removed. The base is simplified to a flat mounting surface, and the cooling fin directly bridges the semiconductor element to the refrigerant passage, achieving both structural simplicity and high heat transfer efficiency.

Inventive Principle:

Principle #2Taking out (Extraction)

Solution Approach 2:

The cooling fin acts as an intermediary heat transfer component that directly connects the semiconductor element mounting surface to the refrigerant passage. This mediator element enables efficient heat transfer without requiring complex base structures or large distances between components.

Inventive Principle:

Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration significantly reduces the heat transfer path length, allowing for efficient heat dissipation from the semiconductor element to the refrigerant, thereby improving cooling performance and reducing circulation resistance.

Implementation Method 1

heat of the semiconductor element can be dissipated well to the refrigerant

Methodology Applied

Scientific EffectHeat conduction: Conduction (thermal)

Implementation Method 2

a refrigerant passage through which a refrigerant circulates

Methodology Applied

Scientific EffectConvection: Convection

Data Source

PatentUS12183658B2Semiconductor module

Publication Date: 2024.12.31 MITSUBISHI ELECTRIC CORP

AI summary

A semiconductor module includes a refrigerant jacket including a refrigerant passage through which a refrigerant circulates and an opening extending from an outer surface to the refrigerant passage, a base mounted on the refrigerant jacket and closing the opening, and a semiconductor element provided at the base. The base includes an annular peripheral wall positioned inside the opening, a bottom plate connected to an end portion of the peripheral wall on a side closer to the refrigerant passage, and a fin protrusion protruding from the bottom plate toward the inside of the refrigerant passage and formed on the bottom plate. The base has a recess formed with the peripheral wall and the bottom plate and extending toward the opening. The semiconductor element is disposed on the bottom plate inside the recess.