Double-Sided Semiconductor Module With Separate Heat Paths
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Solution Overview
Problem
Existing semiconductor modules suffer from reduced heat dissipation due to shared heat dissipation paths between components mounted on both surfaces of a double-sided mounting board, leading to inefficient thermal management.
Innovation Solution
A semiconductor module design where semiconductor components are mounted on both surfaces of a substrate with separate heat dissipation paths, utilizing a substrate, conductive columnar terminals, and a metal film to transfer heat generated by different components independently, with a second semiconductor component having a circuit formation layer, insulation layer, and support member exposed to a mold resin.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If semiconductor components are mounted on both surfaces of a double-sided mounting board, then the device integration is improved, but the heat dissipation performance deteriorates due to shared heat dissipation paths
Solution Approach 1:
The heat dissipation paths are segmented into separate paths for components on the first surface and second surface. The first heat dissipation path includes the substrate and first external connection terminals, while the second heat dissipation path includes the support member and second external connection terminals. This segmentation prevents heat from both surfaces from converging on the same path, resolving the heat dissipation conflict while maintaining dual-surface mounting capability.
2Temperature
If components are mounted on one surface only, then the heat dissipation path is simplified, but the device integration and space utilization deteriorate
Solution Approach 1:
The patent utilizes the third dimension (vertical depth) by introducing a support member that extends from the second surface of the substrate to the second external connection terminals. This dimensional extension creates independent heat dissipation pathways in the vertical direction, allowing both single-surface simplicity and dual-surface integration to coexist by distributing heat paths across different spatial dimensions.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Improves heat dissipation efficiency by separating heat transfer paths for each component, reducing thermal resistance and enhancing overall thermal management, particularly for high-frequency signal processing devices.
Implementation Method 1
The heat generated by the second semiconductor component is transferred to the outside through mainly the metal film
Implementation Method 2
The heat generated by the first semiconductor component is transferred to the outside through mainly the substrate and the columnar terminals
Data Source
AI summary
A substrate has first and second surfaces that face away from each other. A first semiconductor component is mounted on the first surface. A second semiconductor component is mounted on the second surface. A first mold resin on the first surface molds the first semiconductor component. A second mold resin on the second surface molds the second semiconductor component and has a third surface that faces the same direction as the second surface. Conductive columnar terminals pass through the second mold resin from the second surface and reach the third surface. The second semiconductor component includes a circuit formation layer on which an electronic circuit including a transistor is disposed, an insulating support member, and an insulation layer, made of an inorganic insulating material, that is between the circuit formation layer and the support member, and the second semiconductor component is mounted on the second surface.