Semiconductor Module Heat Plate Grooves for Stable Thermal Transfer
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Solution Overview
Problem
The existing semiconductor modules experience a decline in heat radiation properties over time due to thermal deformation and thermal interference between semiconductor chips, leading to reduced effectiveness in maintaining efficient heat transfer.
Innovation Solution
The semiconductor module incorporates a heat radiating plate with recess portions and grooves on its surface, filled with thermal grease, which allows for replenishment during thermal deformation and alleviates thermal interference between adjacent chips, thereby maintaining heat radiation efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If small honeycomb-shaped holes are provided in the heat radiating plane to capture voids, then heat radiation property is maintained initially, but the effect diminishes over time and insufficient for long-term use
Solution Approach 1:
The patent pre-provides filler material in recess portions of the heat radiating plate before assembly. When thermal deformation occurs and voids form, the filler is already positioned to automatically fill these voids, maintaining heat radiation efficiency throughout the operating period without requiring external intervention.
Solution Approach 2:
The patent changes the physical state and distribution of the filler material by placing it in recess portions that can deform with thermal expansion. This allows the filler to move and redistribute itself in response to temperature changes, maintaining contact and heat transfer efficiency over time.
2Reliability
If filler is filled between heat radiating plate and heat sink, then heat transfer is improved, but thermal deformation causes pumping out of filler and deterioration of heat radiation property
Solution Approach 1:
The patent nests the filler material within recess portions of the heat radiating plate structure. This nested configuration allows the filler to be contained and guided by the recess geometry, preventing it from being pumped out while still allowing it to expand and fill voids created by thermal deformation.
Solution Approach 2:
The patent utilizes thermal expansion of the filler material and the deformable recess portions to maintain filler position. As temperature increases, both the filler and recess portions expand together, allowing the filler to remain contained while filling any gaps that form, thus maintaining stable heat transfer properties.
3Volume of moving object
If semiconductor chips are arranged closely to improve module density, then compactness is improved, but thermal interference between adjacent chips increases maximum temperature
Solution Approach 1:
The patent introduces grooves as intermediary structures between adjacent semiconductor chips. These grooves act as thermal barriers that prevent direct thermal interference between chips while maintaining close spacing, thus allowing high module density without excessive temperature rise.
4Temperature
If grooves are provided between semiconductor chips to reduce thermal interference, then maximum temperature is lowered, but device complexity increases
Solution Approach 1:
The patent designs the heat radiating plate with integrated multi-functionality: the same plate provides the bonding surface for semiconductor chips, contains the filler material in recess portions, and includes grooves for thermal isolation. This universal structure achieves multiple functions without adding separate components, thus managing complexity while providing thermal management benefits.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively suppresses the deterioration of heat radiation properties and reduces maximum temperatures, minimizing thermal stress and the likelihood of thermal grease depletion, thus extending the time for effective heat radiation.
Implementation Method 1
when pumping out occurs due to thermal deformation of the heat radiation plate, the filler filled in the plurality of recess portions is extruded to the surface facing the heat sink
Implementation Method 2
a heat sink on which the module substrate is mounted, and a filler filled between the module substrate and the heat sink
Data Source
AI summary
A plurality of semiconductor chips, a module substrate on which the plurality of semiconductor chips are mounted, a heat sink on which the module substrate is mounted, and a filler filled between the module substrate and the heat sink are included, in which the module substrate includes a heat radiating plate, and an insulating substrate on which the plurality of semiconductor chips are mounted, the heat radiating plate has a plurality of recess portions provided on a surface facing the heat sink and at least one groove, the plurality of recess portions are provided in regions corresponding to below arrangement regions of the plurality of semiconductor chips, the at least one groove is provided in a region corresponding to below a region between at least one of the plurality of semiconductor chips and an adjacent other semiconductor chip, and the filler also is filled in the plurality of recess portions.