Power Semiconductor Module Heat Post Layout for EMI and Thermal Reliability
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Solution Overview
Problem
Conventional power semiconductor modules face issues such as assembly failures, thermal and mechanical reliability problems, and electromagnetic interference due to height variations and electromagnetic susceptibility, especially in high-temperature and high-voltage environments, which can lead to malfunctions and safety risks.
Innovation Solution
The power semiconductor module design includes a first and second substrate with a heat dissipation post positioned vertically to overlap power semiconductor devices, eliminating the need for additional spacers and grounding the metal heat dissipation post to block electromagnetic interference, while ensuring proper heat dissipation and electrical connectivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If conventional power semiconductor modules are used in high-temperature and high-voltage environments, then power conversion performance is improved, but assembly failures and thermal-mechanical reliability problems occur due to height variations and thermal fatigue
Solution Approach 1:
The patent merges the heat dissipation post and the support structure into a single integrated component. The heat dissipation post serves dual functions: dissipating heat from the power semiconductor device and providing mechanical support to maintain proper spacing between substrates. This eliminates the need for separate spacer structures and reduces assembly complexity, thereby improving both power conversion performance and assembly reliability in high-temperature and high-voltage environments.
Solution Approach 2:
The heat dissipation post is designed to perform multiple functions simultaneously: thermal management (heat dissipation), mechanical support (maintaining substrate spacing), and electrical grounding (providing a ground path). This multi-functionality reduces the number of components needed, simplifies the module structure, and enhances overall reliability by reducing potential failure points from multiple components to a single integrated structure.
2Reliability
If additional spacer structures are added to maintain height variations, then assembly reliability is improved, but device complexity and electromagnetic interference increase
Solution Approach 1:
The patent eliminates separate spacer structures by integrating the spacing function into the heat dissipation post itself. The heat dissipation post is designed with a specific height that maintains the required spacing between the first and second substrates, while also serving as the primary heat dissipation and grounding structure. This reduction in component count simplifies the overall device structure and reduces potential sources of electromagnetic interference.
Solution Approach 2:
The patent extracts and eliminates unnecessary spacer structures from the module design. By recognizing that the heat dissipation post can fulfill both thermal and mechanical support functions, the design removes redundant components that would otherwise add complexity and potential electromagnetic interference, while maintaining assembly reliability through the integrated post structure.
3Object-affected harmful factors
If heat dissipation posts are grounded, then electromagnetic interference is reduced, but electrical connectivity requirements become more stringent
Solution Approach 1:
The heat dissipation post is designed as a multi-functional component that simultaneously provides thermal management, mechanical support, and electrical grounding. By integrating the grounding function into the existing heat dissipation post structure, the patent reduces electromagnetic interference without requiring additional grounding components. The post's dual role as both thermal path and electrical ground simplifies the overall grounding architecture while maintaining effective EMI suppression.
4Speed
If WBG power semiconductor devices are used for high-temperature operation, then switching performance is improved, but thermal management requirements become more critical
Solution Approach 1:
The patent merges the heat dissipation function with the mechanical support function in a single integrated post structure. This consolidated approach optimizes the thermal path from the WBG power semiconductor device through the heat dissipation post to the heatsink, while simultaneously providing the necessary mechanical support. The integrated design ensures efficient heat removal to support the high-temperature operation capabilities of WBG devices.
Solution Approach 2:
The heat dissipation post acts as an intermediary structure that facilitates efficient heat transfer from the WBG power semiconductor device to the external cooling system. By providing a dedicated thermal path through this integrated post structure, the patent enables effective thermal management that supports the high switching speeds and high-temperature operation characteristics of WBG devices.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design prevents assembly failures, enhances thermal and mechanical reliability, and reduces electromagnetic interference, thereby improving the safety and performance of power semiconductor modules in high-temperature and high-voltage applications.
Implementation Method 1
heat dissipation post bonded to the second substrate... vertically overlap the power semiconductor device... ensures proper heat dissipation
Implementation Method 2
grounding the metal heat dissipation post to block electromagnetic interference... reduces electromagnetic interference
Data Source
Figure 1~2
Figure 3~5A
Figure 5B~6A
AI summary
A power semiconductor module according to an embodiment may include a first substrate, a power semiconductor device bonded to the first substrate, a second substrate bonded to the power semiconductor device, a heat dissipation post bonded to the second substrate, and a molding member surrounding the first substrate, the power semiconductor device, the second substrate, and the heat dissipation post. In addition, a top surface of the heat dissipation post may be exposed through the molding member. In addition, a height of a top surface of the heat dissipation post may be the same as a height of the top surface of the molding member. In addition, the heat dissipation post may vertically overlap the power semiconductor device.