Semiconductor Module Heat Radiating Plate Thermal Management
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Solution Overview
Problem
Semiconductor modules with mixed heat-generating semiconductor devices face challenges in efficiently radiating heat, particularly with control elements like AMB generating more heat than memory elements, leading to temperature issues that affect operational characteristics.
Innovation Solution
A semiconductor module design incorporating heat conducting sheets with varying conductivities between the module body and semiconductor devices, and a heat radiating plate covering multiple devices, with a clip system for integration, ensures effective heat dissipation by using high-conductivity sheets for high heat-generating devices and lower conductivity sheets for lower heat-generating devices, and optimizing the placement and thickness of heat conducting sheets.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a uniform high-conductivity heat conducting sheet is used for all semiconductor devices, then heat radiation from high heat-generating devices is improved, but cost increases and thermal management optimization is reduced
Solution Approach 1:
The patent applies different heat conducting sheet materials with different thermal conductivities to different semiconductor devices based on their individual heat generation characteristics. High heat-generating devices receive high-conductivity sheets while low heat-generating devices receive lower-conductivity sheets, optimizing thermal management while controlling costs.
Solution Approach 2:
The heat conducting sheets are segmented into multiple types with different thermal conductivities (e.g., first heat conducting sheet with conductivity 1-5 W/mK, second with 5-10, third with 10-20, fourth with 20+) and assigned to different semiconductor devices based on their heat generation levels, rather than using a uniform material across all devices.
2Temperature
If a heat radiating plate is designed to cover multiple semiconductor devices, then heat radiation efficiency is improved, but mounting complexity increases
Solution Approach 1:
A single heat radiating plate serves multiple semiconductor devices simultaneously, functioning as a universal thermal management component. The plate is designed with a structure that can accommodate and thermally couple with multiple devices of different types and heat generation levels through the corresponding heat conducting sheets.
3Reliability
If high-conductivity heat conducting sheets are used for all devices, then thermal management is optimized, but cost increases
Solution Approach 1:
Different heat conducting sheet materials with different thermal conductivities are selectively applied to different semiconductor devices based on their individual heat generation characteristics. High heat-generating devices receive high-conductivity sheets while low heat-generating devices receive lower-conductivity sheets, optimizing thermal management while controlling costs.
Solution Approach 2:
The thermal conductivity parameter of the heat conducting sheets is varied across different materials (ranging from 1 W/mK to 20+ W/mK) to match the thermal management needs of different semiconductor devices, rather than using a single fixed conductivity value for all devices.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances heat radiation properties, stabilizes operational characteristics, and allows for easy mounting of high heat-generating semiconductor devices, reducing operating temperatures by up to 33% compared to using uniform high-conductivity sheets.
Implementation Method 1
a heat conducting sheet is interposed between a module main body mounted to a board and an outer face of the semiconductor device
Implementation Method 2
a heat radiating plate is mounted to cover the outer faces of the semiconductor devices over two pieces or more of the semiconductor devices
Data Source
AI summary
A semiconductor module in which a plurality of kinds of semiconductor devices having different heat generating amounts in being operated are mixedly present, heat conducting sheets are interposed between a module main body mounted to a board and outer faces of the semiconductor devices, and heat radiating plates are mounted thereto by covering outer faces of the semiconductor devices over two pieces or more of the semiconductor devices, wherein the heat conducting sheet having a heat conductivity higher than a heat conductivity of the heat conducting sheet used for the semiconductor device having a heat generating amount smaller than a heat generating amount of the semiconductor device is used for the semiconductor device having a large heat generating amount in the semiconductor devices.