Semiconductor Module Heat Radiation Layout
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Solution Overview
Problem
Existing semiconductor drive devices face limitations in heat radiation property and layout efficiency due to inadequate wiring structures within semiconductor modules, leading to increased module size and heat resistance imbalances between switching elements.
Innovation Solution
The semiconductor module incorporates switching elements mounted on lead frames with heat radiation surfaces on the lower side and flat surface portions on bus bars, allowing for improved heat radiation and layout by arranging heat radiation surfaces in a single plane and using a sealing resin to seal the module, while maintaining insulation for efficient heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If heat is radiated only from one face of the semiconductor module, then the structure is simple, but the heat radiation property is limited
Solution Approach 1:
The patent transitions from single-face heat radiation to dual-face heat radiation by utilizing both upper and lower surfaces of the semiconductor module for heat dissipation. This dimensional change in heat radiation geometry effectively doubles the heat radiation area, significantly improving the heat radiation property without requiring complex internal wiring restructuring.
Solution Approach 2:
The bus bar is designed to serve multiple functions: it provides electrical connection between switching elements and simultaneously acts as a heat radiation component with its flat surface portion. This multi-functionality allows the same structure to contribute to both electrical connectivity and thermal management, reducing the need for additional dedicated heat radiation structures.
2Temperature
If the module size is increased to radiate heat from both surfaces, then heat radiation property improves, but the layout property deteriorates
Solution Approach 1:
The patent utilizes the vertical dimension by arranging heat radiation surfaces on both upper and lower faces of the module, rather than expanding the horizontal footprint. This allows heat radiation from both surfaces while maintaining a compact module size, effectively using the Z-axis for heat dissipation without increasing the X-Y plane area.
Solution Approach 2:
The bus bar is designed with a specific local structure featuring a flat surface portion that serves as a dedicated heat radiation area. This localized heat radiation structure is positioned strategically to optimize thermal dissipation from the switching elements without requiring the entire module to be enlarged, thus improving heat radiation while maintaining compact dimensions.
3Temperature
If heat radiation surfaces are not arranged in one plane, then layout flexibility is reduced, but heat radiation efficiency may improve through better thermal contact
Solution Approach 1:
The patent arranges the heat radiation surfaces of the bus bar and lead frame in the same plane, creating an equipotential thermal surface. This planar arrangement ensures uniform thermal contact with the heat sink, optimizing heat transfer efficiency while simultaneously providing excellent layout properties that facilitate easy assembly and manufacturing. The co-planar configuration eliminates thermal contact gaps and ensures consistent thermal performance across the entire heat radiation interface.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances both heat radiation and layout properties by allowing heat to be dissipated from two faces, reducing heat resistance, and improving the overall efficiency and design flexibility of the semiconductor module.
Implementation Method 1
heat radiation surfaces are formed on the side of lower surfaces of lead frames... allowing heat to be dissipated from two faces
Implementation Method 2
heat radiation property... heat is dissipated from two faces
Implementation Method 3
sealing resin for sealing the lead frames and the switching elements except heat radiation surfaces... maintaining insulation for efficient heat dissipation
Data Source
AI summary
A semiconductor module forming a semiconductor device includes lead frames in which switching elements are mounted on the side of upper surfaces and heat radiation surfaces are formed on the side of lower surfaces, and bus bars disposed on the lead frames and connecting between plural switching elements. The heat radiation surfaces of the lead frames are arranged on one plane and upper surfaces of flat surface portions of the bus bars are arranged on one plane, therefore, a layout property on the heat radiation surfaces or the upper surfaces the flat surface portions is good, which facilitates creation of a heat radiation structure and so on.