Semiconductor Module Layout for Heat Dissipation and Solder Reliability
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional semiconductor modules face challenges in heat dissipation and reliability due to thermal distortion of solder joints and inadequate cooling of the substrate, especially when large currents flow through the wiring layers.
Innovation Solution
A semiconductor module design that includes a substrate with layered DC and AC wiring, a semiconductor package with terminal connections, and a heat dissipation base that overlaps the first layered-wiring connection portion to enhance heat transfer and dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If DC wiring and AC wiring are layered on the substrate to reduce inductance and wiring area, then the wiring area is reduced, but thermal distortion of solder joint increases due to temperature rise in the substrate
Solution Approach 1:
The patent introduces a through-substrate via structure that extends the heat dissipation path from the substrate surface into the substrate thickness direction. The via hole penetrates through the substrate, allowing heat to be conducted from the layered wiring region deep into the substrate and dissipated through the opposite surface, effectively adding a third dimension to the heat dissipation pathway.
Solution Approach 2:
The via hole structure acts as an intermediary heat conduction path between the layered wiring region and the substrate's opposite surface. By filling the via hole with conductive material, the patent creates a thermal bridge that mediates heat transfer from the high-density wiring area through the substrate, reducing thermal distortion at the solder joint while maintaining the compact layered wiring configuration.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively improves heat dissipation and reliability by reducing thermal distortion of solder joints and enhancing cooling of the substrate, thereby extending solder life and ensuring consistent performance.
Implementation Method 1
a heat dissipation base that dissipates heat from the DC wiring and the AC wiring
Data Source
AI summary
Provided is a semiconductor module which realizes improvement in both heat dissipation and reliability. This semiconductor module comprises: a substrate (13) having DC wirings (14, 15) and AC wirings (16); and a semiconductor package (50). The substrate (13) has: a lamination region (61); and a connection region (62) having a terminal connection part (63) to be connected to a terminal. The connection region (62) has a first lamination wiring connection part (60) for electrically mutually connecting a plurality of the DC wirings (14, 15) or the AC wirings (16). The first lamination wiring connection part (60) is provided at a position not overlapping the terminal connection part (63) in the thickness direction of the substrate (13). A heat dissipation base (65) is disposed on the surface, of the substrate (13), opposite to the surface to be connected to the terminal, in a range that at least includes a position overlapping with the first lamination wiring connection part (60) in the thickness direction of the substrate (13).