Semiconductor Module Heat Sink Structure for Overload Thermal Capacity
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Planar electronic packaging technology in semiconductor modules struggles to integrate additional thermal capacities, which are necessary for managing high and short-term overload conditions and maintaining small chip temperature fluctuations.
Innovation Solution
A semiconductor module design featuring a metallic heat sink with a main body and fins, thermally connected to the semiconductor element and electrically connected to a second substrate, utilizing a circumferential contact surface for material-bonded connections and edge metallization for enhanced thermal and electrical conductivity, allowing for efficient heat dissipation and mechanical stabilization.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If planar electronic packaging technology is used, then the semiconductor module structure is simple and easy to manufacture, but additional thermal capacities cannot be integrated
Solution Approach 1:
The patent transitions from a planar two-dimensional packaging structure to a three-dimensional structure by introducing a heat sink with fins that extend vertically from the substrate. This dimensional change allows thermal capacity to be integrated without compromising manufacturing simplicity, as the fins are formed as integral parts of the heat sink component.
Solution Approach 2:
The heat sink is nested within a recess in the substrate, with the fin structure fitting into the available space. This nesting approach allows the thermal management component to be integrated into the existing package structure without requiring additional external space, maintaining manufacturing simplicity while adding thermal capacity.
2Temperature
If a metallic heat sink with fins is integrated, then thermal capacity is improved, but the device structure becomes more complex
Solution Approach 1:
The heat sink is merged with the substrate by forming an integral connection where the heat sink base sits on the substrate surface and the fins extend upward. This merging reduces the number of separate components and assembly steps, thereby reducing device complexity while maintaining effective thermal capacity.
Solution Approach 2:
The heat sink serves multiple functions: it provides thermal capacity for overload conditions, acts as a mechanical support structure, and facilitates heat dissipation through the fin structure. This multi-functionality reduces the need for additional separate components, thereby reducing overall device complexity.
3Reliability
If the circumferential contact surface is arranged on the side facing away from the semiconductor element, then material-bonded connection with substrate metallization is established, but the contact surface area is reduced
Solution Approach 1:
The heat sink's contact surface is segmented into two distinct areas: a large planar base surface for thermal contact with the semiconductor element, and a circumferential contact surface for material-bonded connection with the substrate metallization. This segmentation allows each surface to be optimized for its specific function without compromising the other.
Solution Approach 2:
Different surfaces of the heat sink are assigned different qualities and functions: the top surface provides large area for thermal contact, while the circumferential edge provides a specialized bonding surface. This local differentiation ensures that the circumferential contact surface, though smaller, is positioned where it can effectively establish material-bonded connections with the substrate metallization.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design effectively manages heat loss and maintains reliability by ensuring uniform heat distribution and mechanical stability, even under high and short-term overloads, thereby improving the semiconductor module's performance.
Implementation Method 1
the metallic heat sink is in thermally conductive connection with the semiconductor element
Implementation Method 2
a solder material, for example, can be dispensed through the through-hole using capillary forces acting in the through-hole and in the gap
Data Source
AI summary
A semiconductor module includes a semiconductor element having a first side in contact with a first substrate in a planar manner, and a second side which faces away from the first side and contacts a metallic heat sink in a planar manner. The heat sink is in thermally conductive connection with the semiconductor element and connected to the second substrate in an electrically conductive manner. The heat sink includes a main body for planar contacting of the semiconductor element and a fin arranged in a recess of the second substrate. The second substrate is connected in an electrically conductive manner to the main body which has a circumferential contact surface around the fin to establish a material-bonded connection with a substrate metallization of the second substrate. The circumferential contact surface is arranged on a side of the main body facing away from the semiconductor element.