Semiconductor Module Housing Bonding Without Die Heat Damage
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Solution Overview
Problem
Existing methods for mounting and sealing a housing onto a semiconductor module carrier, such as heat stacking, can cause thermal damage to solder or sinter joints and lead to semiconductor die detachment or tilting, resulting in inefficient or defective modules.
Innovation Solution
A method involving an electrically insulative housing with a circumferential frame and an electrically inducible element, where the joining section is inductively heated above the glass transition temperature and pressed onto a metallic sheet to form a direct thermoplastic bond without heating the substrate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If heat stacking process is used to mount housing onto metallic carrier, then direct joint between housing and carrier is formed, but the metallic carrier is heated above 250 C causing thermal damage to solder or sinter joints and leading to semiconductor die tilting or detachment
Solution Approach 1:
The patent segments the heating function by introducing a separate electrically inducible element (heating element) that is distinct from the metallic carrier. This heating element is positioned between the housing and carrier, allowing localized heating at the joining section without heating the entire carrier and semiconductor dies, thus resolving the contradiction between forming a strong joint and avoiding thermal damage
Solution Approach 2:
The electrically inducible element acts as an intermediary component between the housing and the metallic carrier. It mediates the joining process by providing localized heating and pressure transmission, enabling direct joint formation without requiring the metallic carrier itself to be heated to high temperatures, thereby preventing thermal damage to the semiconductor dies
2Reliability
If conventional mounting methods with glue are used, then housing is sealed onto carrier, but additional sealing steps and isolating gel are required increasing process complexity
Solution Approach 1:
The patent merges the mounting and sealing functions into a single direct joint between the housing and metallic carrier. The joining section of the housing is directly joined to the carrier surface, eliminating the need for separate glue application and curing steps, as well as removing the requirement for isolating gel, thus reducing process complexity while maintaining sealing reliability
Solution Approach 2:
The patent extracts and removes the intermediate sealing materials (glue and isolating gel) from the mounting process. By achieving direct joint formation between the housing and carrier through the electrically inducible element method, the need for these additional sealing components is eliminated, simplifying the overall process
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method forms a stable direct joint without thermal damage to the conductive layer, reducing the risk of semiconductor die tilting and ensuring reliable module performance.
Implementation Method 1
inductively heating the electrically inducible element in the circumferential frame such that the joining section of the circumferential frame is heated above a glass transition temperature
Data Source
Figure 1A~1C
Figure 1D~2
Figure 3~4
AI summary
A semiconductor module comprises a metallic sheet comprising a first surface. The semiconductor module further comprises a semiconductor die coupled to the first surface of the metallic sheet. An electrically insulative housing comprises a circumferential frame, wherein the electrically insulative housing encloses the semiconductor die and at least a part of the first surface of the metallic sheet. Furthermore, a joining section of the circumferential frame is directly joined to the first surface of the metallic sheet, wherein an electrically inducible element is enclosed near the joining section of the circumferential frame.