Semiconductor Module Identification Terminals for Easy Product Checking
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Solution Overview
Problem
Existing semiconductor devices face difficulties in easily identifying product information due to structural limitations, making it challenging to check the print on the mounting board.
Innovation Solution
A semiconductor module with identification terminals protruding from the package, allowing information to be identified through electrical characteristics, appearance, or shape, eliminating the need to check prints on the mounting board.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of information
If product information is printed on the mounting board and viewed through an opening, then information can be displayed, but it becomes difficult to check the print depending on the mounting board structure
Solution Approach 1:
The patent extracts the product information display function from the mounting board print and relocates it to the semiconductor device package itself. The package surface directly displays product information through markings, model numbers, or codes, eliminating the need to view information through openings in the mounting board. This extraction resolves the visibility issue by making information accessible directly on the device surface.
Solution Approach 2:
The patent introduces an intermediary element - the package surface markings - between the product information and the user. Instead of requiring direct viewing through mounting board openings, the information is mediated through visible markings on the package exterior, which can be observed from above without disassembly or complex viewing arrangements.
2Loss of information
If openings are made larger on the substrate to improve visibility, then product information becomes easier to check, but the risk of short-circuits increases
Solution Approach 1:
The patent removes the dependency on large substrate openings by extracting the information display function to the package surface. This eliminates the need to enlarge openings that would compromise electrical insulation and increase short-circuit risks, while still achieving good information visibility through direct markings on the package.
Solution Approach 2:
Instead of making the substrate opening larger to improve visibility, the patent inverts the approach by making the information display location (package surface) the primary viewing interface. This reversal eliminates the need for large openings in the substrate, maintaining electrical safety while achieving the visibility goal.
3Loss of information
If the semiconductor module is detached from the heat radiation fin to check information, then product details can be viewed, but the operation becomes complex and time-consuming
Solution Approach 1:
The patent extracts the product information display from locations requiring module disassembly (such as the mounting board beneath the heat radiation fin) and places it directly on the package surface. This allows information to be viewed while the module remains assembled, eliminating complex detachment operations and reducing inspection time.
Solution Approach 2:
The package surface itself serves as the information display medium, providing self-service information accessibility. The markings, model numbers, and codes on the package exterior can be directly observed without requiring external viewing mechanisms or disassembly operations, enabling quick identification while the module remains in its operational assembled state.
Data Source
AI summary
A semiconductor module according to the present disclosure includes a package, a main terminal protruding from the package, a control terminal protruding from the package, and at least one identification terminal protruding from the package, in which information on a product is identifiable from an electrical characteristic, an appearance, or a shape of the at least one identification terminal.