Semiconductor Module with Inclined Groove for Thermal Conduction
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Solution Overview
Problem
Conventional semiconductor module mounting technologies often fail to achieve sufficient heat radiation performance due to limited contact between the semiconductor chip and the sub-mount, leading to potential characteristic deterioration from increased element temperature.
Innovation Solution
A semiconductor module design featuring a base body with inclined inner side surfaces forming a groove, where the semiconductor element is positioned such that its inclined side surfaces contact the base body, increasing the contact area and improving heat radiation performance through crimping of electrodes onto electrode pads on the base body.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the semiconductor chip is mounted on a sub-mount with conventional contact methods, then the mounting process is simple, but the contact area is limited and heat radiation performance is insufficient
Solution Approach 1:
The invention transitions from conventional point or surface contact mounting to multi-dimensional contact by positioning the semiconductor chip within a groove structure. The chip contacts the sub-mount at multiple locations including the groove bottom and groove sides, effectively utilizing three-dimensional space to maximize contact area while maintaining manufacturing simplicity.
Solution Approach 2:
The semiconductor chip is nested within the groove structure of the sub-mount, with the groove providing a containment structure that ensures optimal contact between the chip and sub-mount. This nesting arrangement allows the chip to be securely positioned while maximizing thermal contact area without complicating the manufacturing process.
2Reliability
If the contact area between semiconductor element and base body is increased, then heat radiation performance improves, but the structural complexity increases
Solution Approach 1:
The sub-mount is segmented by forming a groove structure that divides the contact region into distinct zones (groove bottom and groove sides). This segmentation allows the semiconductor chip to contact multiple discrete regions of the sub-mount, increasing overall contact area while the groove itself is formed using standard fabrication techniques that do not significantly increase structural complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances heat radiation performance and achieves a highly reliable semiconductor module by increasing the contact area between the semiconductor element and the base body, allowing for effective heat dissipation and stable operation over time.
Implementation Method 1
increasing the contact area between the semiconductor element and the base body, allowing for effective heat dissipation
Data Source
AI summary
A semiconductor module of the present disclosure includes: a base body including a groove part of which two inner side surfaces are inclined, the base body including an electrode pad which is provided on at least one inner side surface; and a semiconductor element including a semiconductor substrate including a first surface, a second surface opposite to the first surface, and two side surfaces which are inclined in a diagonal direction to the first surface and are opposite to each other, a semiconductor layer located on the first surface, and an electrode disposed on at least one side surface. The semiconductor element is located in the groove part so that the at least one side surface is disposed along the at least one inner side surface of the base body, and at least one electrode of the semiconductor element is connected to the electrode pad of the base body.