Semiconductor Module Inner Conductive Layer External Bonding
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Solution Overview
Problem
Conventional semiconductor modules require leads for electrical connection to external members, which complicates their configuration and increases the risk of short circuits.
Innovation Solution
The semiconductor module eliminates the need for leads by using a stacked substrate with inner and outer conductive layers that are directly connected to the semiconductor element and protrude outside the encapsulant, allowing for external bonding without intermediate leads.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If leads are used for electrical connection to external members, then electrical connection is achieved, but device complexity increases and short circuit risk increases
Solution Approach 1:
The patent extracts and eliminates the lead component from the semiconductor module. The inner conductive layer is designed to protrude directly from the encapsulant, replacing the function of leads without using separate lead wires. This extraction of the lead component directly reduces device complexity and eliminates potential short circuit risks associated with lead connections.
Solution Approach 2:
The patent merges the electrical connection function with the substrate structure itself. The inner conductive layer is integrated into the stacked substrate and simultaneously serves as both the substrate's conductive path and the external connection interface. This merging eliminates the need for separate leads while maintaining electrical connectivity.
2Ease of manufacture
If leads are used for electrical connection, then external bonding is enabled, but manufacturing complexity increases
Solution Approach 1:
By extracting the lead component and replacing it with the protruding inner conductive layer, the manufacturing process is simplified. The inner conductive layer is formed as an integral part of the stacked substrate through standard PCB fabrication processes, eliminating the need for separate lead attachment operations such as wire bonding or lead frame assembly.
Solution Approach 2:
The inner conductive layer is designed to be self-sufficient, serving both as the electrical connection path within the substrate and as the external bonding interface. This self-service design eliminates the need for additional components or assembly steps to establish external connections, thereby improving ease of manufacture.
3Device complexity
If leads are eliminated, then device complexity is reduced, but electrical connection to external members must be achieved through alternative means
Solution Approach 1:
The inner conductive layer is designed with multi-functionality, serving both as the internal electrical connection path within the stacked substrate and as the external bonding interface. This universal design allows the same structure to fulfill multiple functions, maintaining adaptability for external connections while reducing device complexity.
Solution Approach 2:
The patent transitions from using separate, protruding lead wires (one-dimensional extension) to using a planar conductive layer that protrudes from the encapsulant surface (two-dimensional integration). This dimensional change allows the inner conductive layer to provide external bonding capability while being more efficiently integrated into the substrate structure, reducing overall complexity.
Data Source
AI summary
A semiconductor module disclosed herein may include: a first semiconductor element; an encapsulant that encapsulates the first semiconductor element; and a first stacked substrate on which the first semiconductor element is disposed, wherein the first stacked substrate may include a first insulator substrate, a first inner conductive layer and a first outer conductive layer, the first inner conductive layer being disposed on one side relative to the first insulator substrate, and the first outer conductive layer being disposed on another side relative to the first insulator substrate; the first inner conductive layer may be electrically connected to the first semiconductor element inside the encapsulant; and a part of the first inner conductive layer may be located outside the encapsulant and be configured to enable an external member to be bonded to the part.