Dual-Side Cooled Semiconductor Module With Insulated Heat Radiation
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Solution Overview
Problem
Existing semiconductor modules face challenges in maintaining heat radiation efficiency and ensuring insulation reliability between semiconductor components and the heat radiation system, particularly with Wide Band Gap power semiconductor devices that generate high temperatures and risk short-circuiting due to metal-to-metal contact.
Innovation Solution
A semiconductor module with a dual side cooling structure using non-conductive and conductive heat radiation components, where coolant flows between multiple stages of heat radiation components formed of different materials, ensuring insulation and efficient heat dissipation through direct cooling.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If metal materials are used for upper and lower bodies of heat radiation system, then thermal conductivity is improved, but insulation reliability deteriorates due to short-circuit risk with semiconductor terminals
Solution Approach 1:
The heat radiation system is divided into multiple heat radiation components (first upper, first lower, second upper, second lower) that can be formed of different materials. This segmentation allows combining non-conductive materials for insulation-critical positions with conductive materials for heat dissipation-critical positions, resolving the contradiction between thermal conductivity and insulation reliability.
Solution Approach 2:
Different heat radiation components are formed of different materials based on their specific functional requirements. Non-conductive materials are used where insulation is critical, while conductive materials are used where heat dissipation is prioritized. This local differentiation of material properties resolves the global contradiction between thermal conductivity and insulation reliability.
2Temperature
If dual side cooling structure is used for high-power semiconductor components, then heat radiation efficiency is improved, but insulation reliability deteriorates due to terminal penetration through air insulation
Solution Approach 1:
The dual side cooling structure is implemented with multiple segmented heat radiation components rather than single solid blocks. This segmentation allows strategic placement of non-conductive materials at critical insulation points while maintaining cooling efficiency through conductive paths, resolving the contradiction between heat radiation efficiency and insulation reliability.
Solution Approach 2:
Non-conductive heat radiation components act as intermediaries between the semiconductor terminals and the cooling system. These intermediary components provide thermal conduction pathways while maintaining electrical insulation, preventing direct metal-to-terminal contact that would cause short-circuits.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution maintains high heat radiation efficiency and secures insulation reliability by preventing short-circuits, enhancing electrical reliability and cooling efficiency with a wide range of material options for the heat radiation components.
Implementation Method 1
a coolant used to cool heat generated from the semiconductor component circulates between the first and second upper heat radiation components or between the first and second lower heat radiation components
Implementation Method 2
a coolant used to cool heat generated from the semiconductor component circulates between the first and second upper heat radiation components
Implementation Method 3
at least any one of the first upper heat radiation component, the first lower heat radiation component, the second upper heat radiation component, and the second lower heat radiation component is formed of a material that is different from each other
Data Source
AI summary
The present invention relates to a semiconductor module including a heat radiation system, and more particularly, to a semiconductor module including a heat radiation system in which heat radiation efficiency of the heat radiation system may be maintained and insulation reliability between semiconductor components and the heat radiation system may be secured.