Power Semiconductor Module Insulation Walls

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Solution Overview

Problem

Conventional IGBT modules face challenges in ensuring adequate insulation distances and clearance when reduced in size, particularly for control terminals in power semiconductor modules used in rolling stocks, leading to potential erroneous wiring and increased module size to comply with insulation standards.

Innovation Solution

The implementation of insulating separation walls with a rib configuration on the terminal block of the molded resin casing, specifically designed to meet the creepage distance and clearance requirements of IEC 60077-1 standards, while allowing for easier recognition of terminal symbols and maintaining a compact module size.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Volume of moving object

If the module size is reduced, then the compactness is improved, but the insulation distance and clearance between control terminals and mounting screws deteriorate

Engineering Contradiction:
Improvemodule sizeVSAvoidinsulation distance
Core Design Contradiction:
Volume of moving objectVSReliability

Solution Approach 1:

The patent introduces insulating separation walls that extend vertically from the terminal block surface, adding a third dimension (height) to the insulation structure. This vertical dimension increases the creepage distance between control terminals and mounting screws without expanding the horizontal footprint of the module, thereby maintaining compact size while improving insulation reliability.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The insulating separation walls act as intermediary structures between the control terminals and mounting screws. These walls physically separate the conductive elements and provide an insulating barrier, mediating the insulation requirement without requiring increased spacing between terminals and screws in the planar direction.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Reliability

If insulating separation walls are added to ensure insulation distance, then the reliability is improved, but the device complexity increases

Engineering Contradiction:
Improveinsulation distanceVSAvoidstructure complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The insulating separation walls are integrated with the terminal block as a single molded component rather than separate parts. This merging of functions (terminal support and insulation) into one piece reduces assembly steps and part count, improving reliability without proportionally increasing device complexity.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The terminal block serves multiple functions: it provides mechanical support for control terminals, establishes electrical connections, and through its integrated insulating separation walls, provides insulation barriers. This multi-functionality reduces the need for additional dedicated insulation components, balancing reliability improvement with controlled complexity.

Inventive Principle:
Principle #6Universality (Multi-functionality)

3Reliability

If the terminal block size is increased to accommodate insulation requirements, then the insulation distance is improved, but the module compactness deteriorates

Engineering Contradiction:
Improveinsulation distanceVSAvoidmodule size
Core Design Contradiction:
ReliabilityVSVolume of moving object

Solution Approach 1:

Instead of increasing the horizontal dimensions of the terminal block to achieve required insulation distances, the patent utilizes the vertical dimension by extending insulating separation walls upward from the terminal block surface. This approach achieves the necessary creepage distance without increasing the module's footprint or overall size.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Data Source

PatentUS8405205B2Power semiconductor module
Publication Date: 2013.03.26 FUJI ELECTRIC CO LTD
  • US8405205B2 patent drawing
  • US8405205B2 patent drawing
  • US8405205B2 patent drawing

AI summary

A power semiconductor module includes a plurality of sets of semiconductor switching elements, a molded resin casing containing the semiconductor switching elements, screw holders for receiving mounting screws formed at bottom regions of four corners of the molded resin casing, first terminal blocks having main circuit terminals, and arranged on a central region of a top surface of the molded resin casing, and second terminal blocks having control terminals arranged at a side edge of the molded resin casing apart. Insulating separation walls having a configuration of a rib erect from a surface of the second terminal blocks, and are interposed between groups of the control terminals corresponding to the sets of semiconductor switching elements, and between the screw holder including the mounting screw therein on the molded resin casing and the control terminal at a high voltage side adjacent to the screw holder.