Semiconductor Module Intermediate Radiators Heat Dissipation

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Solution Overview

Problem

Existing semiconductor modules for power converters, such as those in hybrid and electric cars, face challenges in miniaturization due to heat management issues, where increasing the number of components to enhance heat removal either enlarges the module or increases heat resistance, hindering efficient cooling.

Innovation Solution

A semiconductor module design featuring intermediate plates with high heat conductivity, power semiconductor elements on both main surfaces, heat sinks arranged to hold the elements between them, and a mold part sealed with resin, with exposed heat sink surfaces and projecting intermediate radiators for enhanced heat dissipation, allowing for both efficient heat transfer and miniaturization.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Loss of energy

If power semiconductor elements are arranged in the direction parallel to the main surface of the heat sink, then heat removal is improved, but the area of the heat sink increases and the module size cannot be miniaturized

Engineering Contradiction:

Improveheat removal efficiencyVSAvoidheat sink area

Core Design Contradiction:

Loss of energyVSArea of stationary object

Solution Approach 1:

The patent transitions from a two-dimensional planar arrangement to a three-dimensional stacked configuration by placing intermediate plates between the heat sink and power semiconductor elements. This vertical stacking enables heat dissipation from both surfaces of each semiconductor element without increasing the heat sink's footprint area, effectively utilizing the third dimension to resolve the contradiction between heat removal efficiency and module miniaturization.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The patent implements a nested structure where intermediate plates are positioned within the space between the heat sink and power semiconductor elements. These intermediate plates with radiators are embedded in the vertical stack, allowing heat to be conducted through multiple pathways (heat sink → intermediate plate → power semiconductor element) without requiring additional lateral space, thus nesting cooling functions within the existing vertical architecture.

Inventive Principle:

Principle #7Nested doll (Nesting)

2Volume of stationary object

If power semiconductor elements are arranged in the direction perpendicular to the main surface of the heat sink, then module size is reduced, but the contact area between heat sink and power semiconductor element decreases and heat resistance increases

Engineering Contradiction:

Improvemodule sizeVSAvoidheat resistance

Core Design Contradiction:

Volume of stationary objectVSReliability

Solution Approach 1:

The patent introduces intermediate plates as mediator components between the heat sink and power semiconductor elements. These intermediate plates provide additional heat conduction pathways and increase the effective contact area through their radiator structures, thereby reducing thermal resistance in the vertical arrangement without requiring increased lateral dimensions. The intermediate plates act as thermal bridges that improve heat transfer efficiency in the perpendicular configuration.

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

The patent employs composite thermal management structures combining heat sinks, intermediate plates with radiators, and power semiconductor elements in a stacked configuration. This composite arrangement creates multiple parallel heat conduction paths through different materials and structures, reducing overall thermal resistance while maintaining compact vertical dimensions. The combination of conductive intermediate plates and radiative surfaces forms a composite thermal pathway.

Inventive Principle:

Principle #40Composite materials

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This design achieves effective heat removal and miniaturization by allowing heat to be transferred and radiated from both sides of the semiconductor elements, reducing the area required for the heat sink and enabling compact module design while maintaining excellent thermal performance.

Implementation Method 1

at least one intermediate plate (2) which has heat conductivity

Methodology Applied

Scientific EffectHeat conduction: Conduction (thermal)

Implementation Method 2

The intermediate plate has an intermediate radiator (21) which projects in the direction parallel to the main surface from the mold part (10)

Methodology Applied

Scientific EffectThermal radiation: Thermal Radiation

Implementation Method 3

heat sinks (4) which are arranged so that the power semiconductor elements (3, 30) are held between the heat sinks (4) and the intermediate plate (2)

Methodology Applied

Scientific EffectConvection: Convection

Data Source

PatentUS8946882B2Semiconductor module and semiconductor device

Publication Date: 2015.02.03 DENSO CORP

AI summary

A semiconductor module includes at least one intermediate plate which has heat conductivity, power semiconductor elements which are provided for respective main surfaces of the intermediate plate, heat sinks which are arranged so that the power semiconductor elements are held between the heat sinks and the intermediate plate, and a mold part which seals the intermediate plate, the power semiconductor elements, and the heat sinks with mold resin. Surfaces of the heat sinks opposite to the side of the power semiconductor elements are exposed from the mold part. The intermediate plate has an intermediate radiator which projects in the direction parallel to the main surface from the mold part.