Semiconductor Module With Interposed Circuit Board For Heat Dissipation
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Semiconductor devices using multilayer wiring boards often suffer from unstable electrical signal supply, leading to deteriorated operation performance due to large size and inefficient heat management, which can result in overheating and increased thermal resistance.
Innovation Solution
A semiconductor device design featuring a semiconductor module with conductor layers, conductor blocks, and a circuit board where semiconductor elements are connected through conductor blocks, allowing for improved heat transfer and reduced thermal resistance, and the circuit board is strategically placed to enhance electrical signal controllability and reduce electromagnetic interference.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a multilayer wiring board is used to connect semiconductor elements, then electrical connection is achieved, but the device size increases and heat management becomes inefficient
Solution Approach 1:
The patent transitions from a planar multilayer wiring board structure to a three-dimensional configuration where circuit boards are positioned vertically between conductor layers. This dimensional change allows electrical connections to be achieved through vertical stacking rather than horizontal expansion, reducing the device's planar footprint while maintaining connection functionality.
Solution Approach 2:
The patent implements a nested structure where circuit boards are positioned within the space between conductor layers, with semiconductor elements mounted on the circuit boards. This nesting arrangement allows multiple functional components to occupy the same vertical space, reducing overall device volume while maintaining all necessary electrical connections and heat dissipation pathways.
2Reliability
If a multilayer wiring board is used, then electrical connection is established, but heat radiation efficiency decreases and thermal resistance increases
Solution Approach 1:
The patent introduces circuit boards as intermediary structures between semiconductor elements and external environments. These circuit boards serve dual functions: providing electrical connection pathways and acting as heat dissipation interfaces. The circuit boards are positioned to facilitate direct thermal contact with heat sinks or cooling structures, improving heat radiation efficiency while maintaining electrical connectivity.
Solution Approach 2:
The patent segments the electrical connection and heat dissipation functions into separate structural components. Instead of using a monolithic multilayer wiring board that performs both functions inefficiently, the design separates these functions into conductor layers for electrical connection and circuit boards for heat management, allowing each to be optimized independently for its specific function.
3Ease of manufacture
If conductor layers are positioned far apart, then assembly is easier, but electrical signal stability deteriorates due to increased electromagnetic interference
Solution Approach 1:
The patent optimizes the distance parameter between conductor layers to achieve a balance between assembly ease and signal stability. By carefully controlling the spacing and positioning of conductor layers relative to circuit boards, the design minimizes electromagnetic interference while maintaining manufacturability. The circuit boards act as reference planes that stabilize electrical signals even when conductor layers are positioned at optimal rather than minimal distances.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design achieves smaller device size, improved heat radiation efficiency, reduced overheating, and enhanced operation controllability of semiconductor elements, enabling higher current flow and better performance.
Implementation Method 1
improved heat transfer and reduced thermal resistance
Implementation Method 2
conductor blocks that are formed between the second conductor layer and the group of semiconductor elements, and respectively via which the group of semiconductor elements are connected to the second conductor layer
Data Source
AI summary
A semiconductor device having a semiconductor module that includes a first conductor layer and a second conductor layer facing each other, a group of semiconductor elements that are formed between the first and second conductor layers, and are connected to the second conductor layer respectively via a group of conductor blocks, and a circuit board having one end portion thereof located in a space between the semiconductor elements and the second conductor layer. Each semiconductor element includes first and second main electrodes respectively formed on first and second main surfaces thereof, and a control electrode that is formed on the second main surface. The first main electrode is electrically connected to the first conductor layer. The second main electrode is electrically connected to the second conductor layer via the respective conductor block. The circuit board includes a first wiring layer electrically connected to the control electrodes of the semiconductor elements.