Flexible Substrate Semiconductor Module for Chip Isolation Shielding
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Laminated memory semiconductor modules exhibit low isolation characteristics due to short distances between semiconductor chips, which affects their performance.
Innovation Solution
A semiconductor module design featuring a flexible second substrate with an interstice formation portion overlapping the first substrate, where a first semiconductor chip is partially located in the interstice and a second semiconductor chip is positioned on the opposite side, with conductive layers providing a reference potential to enhance isolation by creating a shielding effect.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If semiconductor chips are laminated with short distances between them, then the module size is reduced and integration density is improved, but the isolation characteristics between chips deteriorate
Solution Approach 1:
A flexible substrate with conductive layers is introduced as an intermediary between the first and second semiconductor chips. The conductive layers form a shielding structure that mediates the electromagnetic interaction between chips, reducing crosstalk while allowing the chips to maintain short distances for compact integration.
Solution Approach 2:
The flexible substrate incorporates conductive layers with specific patterns and configurations in different regions. The conductive layers are strategically positioned to provide enhanced shielding in areas where electromagnetic interference is most significant, while maintaining appropriate isolation characteristics in other regions.
2Object-affected harmful factors
If a flexible substrate with conductive layers is introduced to improve isolation, then the shielding effect is enhanced, but the device complexity increases
Solution Approach 1:
The flexible substrate serves multiple functions simultaneously: it provides mechanical support for the semiconductor chips, establishes electrical connections through the conductive layers, and creates electromagnetic shielding between chips. This multi-functionality reduces the need for separate components and minimizes overall device complexity.
Solution Approach 2:
The conductive layers are integrated directly into the flexible substrate structure, merging the shielding function with the interconnection function. This consolidation eliminates the need for separate shielding structures and simplifies the overall device architecture while maintaining effective isolation characteristics.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration mitigates the reduction in isolation characteristics by creating a shielding effect that weakens electrical coupling between semiconductor chips, improving the module's performance and stability.
Implementation Method 1
the second substrate has a first conductive layer supplied with a reference potential, and in the plan view, at least part of the first conductive layer overlaps with the first semiconductor chip and the second semiconductor chip
Data Source
AI summary
A semiconductor module includes: a first substrate having a main surface; a second substrate having flexibility and including a connection portion connected to the first substrate and an interstice formation portion overlapping with the first substrate in a plan view of the main surface seen in a direction perpendicular to the main surface and forming an interstice between the second substrate and the first substrate; a first semiconductor chip provided in the interstice at least partially; and a second semiconductor chip provided at an opposite side of the second substrate from an interstice side, the second substrate has a first conductive layer supplied with a reference potential, and in the plan view, at least part of the first conductive layer overlaps with the first semiconductor chip and the second semiconductor chip.