Semiconductor Module Keying for Error-Proof Base Plate Mounting
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Solution Overview
Problem
Existing semiconductor devices face challenges in preventing positional displacement and erroneous mounting of semiconductor modules during assembly or solder reflow, particularly for modules with the same outer shape but different types and functions.
Innovation Solution
The semiconductor device incorporates a semiconductor module with a linear protrusion or protrusions provided asymmetrically with respect to the module's center, which fits into a corresponding recess on the base plate, ensuring proper positioning and preventing erroneous mounting by limiting the directional fit.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If protrusions are provided at the same position for semiconductor modules with the same outer shape but different types, then the modules can be fitted into recesses in the cooler, but it becomes difficult to prevent erroneous mounting of the semiconductor modules
Solution Approach 1:
The patent applies asymmetry by providing protrusions at different positions on semiconductor modules with the same outer shape but different types. Specifically, first semiconductor modules have protrusions at first positions while second semiconductor modules have protrusions at second positions, creating asymmetric mounting configurations that prevent erroneous mounting while maintaining ease of fitting into corresponding recesses in the cooler.
2Manufacturing precision
If the distance between protrusions is made different according to the size of the semiconductor module, then positioning can be achieved, but semiconductor modules with the same outer shape and different types cannot be distinguished
Solution Approach 1:
The patent resolves this contradiction by using asymmetric protrusion positioning rather than relying solely on distance variations. By placing protrusions at different positions on modules of the same size but different types, the invention achieves both precise positioning and type identification, preventing erroneous mounting without sacrificing manufacturing precision.
3Manufacturing precision
If a pair of protrusions is provided in the semiconductor module, then positioning is achieved, but the semiconductor module can be erroneously mounted in the opposite direction
Solution Approach 1:
The patent eliminates bidirectional mounting errors by implementing asymmetric protrusion configurations. Instead of symmetric pairs that allow 180-degree rotation, the protrusions are positioned asymmetrically so that only one orientation fits the corresponding recesses in the cooler, ensuring correct directional mounting while maintaining positioning accuracy.
Data Source
AI summary
A semiconductor device according to the present disclosure includes a semiconductor module and a base plate on which the semiconductor module is mounted. The semiconductor module includes a linear protrusion that is provided so as not to be point-symmetric with respect to a center of the semiconductor module on at least one side, and the base plate includes a recess that is provided so as to correspond to the protrusion.