Semiconductor Module Lead Frame Heat Dissipation

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Solution Overview

Problem

Conventional semiconductor modules face challenges in efficiently dissipating heat while maintaining low electrical resistance, as traditional heat dissipation methods often elongate the current path or increase the thickness of conductive members, which can compromise electrical characteristics.

Innovation Solution

The semiconductor module incorporates a lead frame with a heat dissipation portion that extends from the electrical connection portion in a direction different from the current path, utilizing vertically extending and plate-shaped portions at varying heights to enhance heat dissipation without elongating the current path or increasing the thickness of conductive members, thereby improving both electrical characteristics and heat dissipation efficiency.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If traditional heat dissipation methods are used, then heat dissipation efficiency is improved, but electrical resistance increases due to elongated current path or increased thickness of conductive members

Engineering Contradiction:

Improveheat dissipation efficiencyVSAvoidelectrical resistance

Core Design Contradiction:

TemperatureVSReliability

Solution Approach 1:

The heat dissipation portion extends in a direction different from the longitudinal direction of the first plate-shaped portion (e.g., vertically upward or downward), utilizing the third dimension (height) for heat dissipation while keeping the current path in the horizontal plane short, thus resolving the contradiction between heat dissipation efficiency and electrical resistance

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The lead frame is divided into distinct functional portions: the first plate-shaped portion for electrical connection and the heat dissipation portion for thermal management. This segmentation allows each portion to be optimized for its specific function without compromising the other

Inventive Principle:

Principle #1Segmentation

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This design effectively enhances heat dissipation efficiency while maintaining low electrical resistance, allowing for improved thermal management without compromising the electrical performance of the semiconductor module.

Implementation Method 1

The lead frame may have a heat dissipation portion provided to extend from the electrical connection portion

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS10903149B2Semiconductor module, electric vehicle, and power control unit

Publication Date: 2021.01.26 FUJI ELECTRIC CO LTD

AI summary

A semiconductor module is provided to include: a plurality of semiconductor chips; a lead frame that is connected to the plurality of semiconductor chips; and a main terminal that is connected to the lead frame, wherein the lead frame has an electrical connection portion that electrically connects the plurality of semiconductor chips to the main terminal, and a heat dissipation portion that is provided to extend from the electrical connection portion. The heat dissipation portion does not extend a path of a current that flows between the main terminal and the plurality of semiconductor chips.