Semiconductor Module Lid Gap Design for Moisture Resistance
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Solution Overview
Problem
The existing semiconductor modules face impaired moisture resistance due to the need for both an inlet and an outlet at the lid, which increases the exposed area of the seal material to the atmosphere, allowing moisture entry and air bubbles to form inside the module.
Innovation Solution
A semiconductor module design featuring a tapered portion at the end of the lid and a gap between the lid's side surface and the case's inner surface, allowing the seal material to crawl up and fill the gap, reducing the area exposed to the atmosphere and preventing moisture entry, thereby enhancing moisture resistance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If both an inlet and an outlet are provided at the lid for injecting seal material, then air bubbles can be discharged from the outlet, but the exposed area of the seal material increases causing impaired moisture resistance
Solution Approach 1:
The outlet is removed from the lid structure. Instead of having both inlet and outlet at the lid, the outlet function is eliminated and the seal material is injected through the inlet only, allowing air bubbles to escape through the gap between lid and case rather than requiring a dedicated outlet opening.
Solution Approach 2:
A gap is introduced as an intermediary space between the lid and the case. This gap serves as a pathway for air bubble discharge and allows the seal material to crawl up and fill the space, eliminating the need for a lid outlet while maintaining moisture resistance.
2Object-affected harmful factors
If the lid is designed with a tapered portion and gap to allow seal material to crawl up, then the area exposed to atmosphere is reduced, but the lid structure becomes more complex
Solution Approach 1:
The lid end portion is designed with a tapered shape (conical curvature) instead of a straight cylindrical form. This tapered geometry naturally guides the seal material to crawl up along the slope and fill the gap between lid and case, reducing the need for additional complex components while minimizing exposed area.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design effectively reduces the area for moisture entry, improving the module's moisture resistance by ensuring the seal material fills the gap without air bubbles, thus minimizing moisture permeability and preventing air bubble-induced moisture entry.
Implementation Method 1
a gap is provided between a side surface of the end portion of the lid and an inner side surface of the case, and the seal material crawls up to the tapered portion through the gap
Data Source
AI summary
A semiconductor module includes: a case; a semiconductor chip provided inside the case; a seal material injected to inside of the case and sealing the semiconductor chip; and a lid provided inside the case and contacting an upper surface of the seal material, wherein a tapered portion is provided at an end portion of the lid on an upper surface side, a gap is provided between a side surface of the end portion of the lid and an inner side surface of the case, and the seal material crawls up to the tapered portion through the gap.