Semiconductor Module Light Shielding Layer Design
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Solution Overview
Problem
Conventional semiconductor modules with wafer level chip size packages suffer from unnecessary light introduction through the light permeable cover, leading to degraded sensor performance and difficulties in adjusting the lens distance accurately, which affects focusing.
Innovation Solution
A semiconductor module design featuring a light permeable cover with a light shielding layer on its outer circumferential region and side, preventing side light introduction and allowing precise adjustment of the lens distance by setting the thickness of the shielding layer, thereby protecting the cover from handling impacts.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Illumination intensity
If a light permeable cover is used in a conventional CSP structure, then the lens unit can be fixed to the cover and light can reach the semiconductor chip, but unnecessary light is introduced from the side of the cover which reaches the light receiving device and degrades sensor performance
Solution Approach 1:
The light permeable cover is segmented into different functional regions: a light permeable region for transmitting necessary light and a light shielding region for blocking unnecessary light. This segmentation allows the cover to simultaneously perform light transmission and light shielding functions, resolving the contradiction between allowing light access and preventing harmful light interference.
Solution Approach 2:
Different regions of the light permeable cover are assigned different optical properties: the central region is made light permeable to allow necessary light to reach the sensor, while the peripheral region is made light shielding to block unnecessary light from the sides. This local differentiation of properties enables the cover to fulfill both contradictory requirements.
2Device complexity
If the lens unit is fixed to the light permeable cover, then the structure is simplified, but thickness errors of the cover or adhesion errors cause the distance between the lens and the semiconductor chip to be improperly adjusted, affecting focusing
Solution Approach 1:
The light shielding layer is formed on the light permeable cover before the lens unit is fixed to it. This preliminary formation of the shielding layer establishes a precise reference surface and predetermined distance from the semiconductor chip, ensuring that when the lens unit is subsequently fixed to the cover, the lens distance is automatically within the appropriate tolerance range for proper focusing.
3Device complexity
If the light permeable cover is exposed without protection, then the structure remains simple, but the cover may be damaged due to impact during handling in manufacturing
Solution Approach 1:
The light shielding layer serves multiple functions simultaneously: it blocks unnecessary light from reaching the sensor, provides a reference surface for precise lens positioning, and protects the light permeable cover from impact damage during manufacturing. This multi-functionality resolves the contradiction between structural simplicity and manufacturing reliability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances sensor performance by blocking unnecessary light, ensuring accurate focusing and protecting the cover from damage during manufacturing, thus enabling miniaturization and high-performance camera units.
Implementation Method 1
the light permeable cover is provided on an outer circumferential region of the front thereof and on the side thereof with a light shielding layer
Implementation Method 2
Light, incident upon the lens, passes through the light permeable cover and reaches an effective pixel region
Data Source
AI summary
A semiconductor module including a semiconductor chip having a light receiving device formed at a front thereof and a light permeable cover having a front, a back, and a side. The light permeable cover is disposed opposite to the front of the semiconductor chip such that the front of the semiconductor chip is covered by the back of the light permeable cover. The light permeable cover is provided at the outer circumferential region of the front thereof and at the side thereof with a light shielding layer. It is possible to prevent the incidence of unnecessary light from the side of the light permeable cover of a CSP and to easily adjust the distance between a lens and the front of the semiconductor chip within tolerance.