Semiconductor Module Resin Crack Prevention via Locking Projection
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Solution Overview
Problem
Conventional semiconductor modules experience cracks and separation of sealing resin at the end portion of the die pad frame, which can lead to the flow of conductive connection members between the semiconductor chip and the die pad frame.
Innovation Solution
A semiconductor module design featuring a die pad frame with a projection and locking portion at its end, where the locking portion is partially above the projection's surface, and laser grooves on the projection to enhance adhesion with the sealing resin, preventing the flow of conductive connection members and resin cracking or separation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a projection is added to the die pad frame to improve adhesion with sealing resin, then adhesion strength is improved, but the conductive connection member may flow into the sealing resin
Solution Approach 1:
The projection is segmented into two distinct functional parts: a base portion that provides adhesion improvement for the sealing resin, and a locking portion that prevents the conductive connection member from flowing into the sealing resin. This segmentation allows each part to independently fulfill its specific function without interfering with the other.
Solution Approach 2:
Different regions of the projection are given different properties: the base portion has a larger area optimized for adhesion with the sealing resin, while the locking portion has a smaller area and specific geometry (protruding upward with step portions) optimized for blocking the conductive connection member. This local differentiation of properties resolves the contradiction between adhesion and electrical connection reliability.
2Strength
If the projection extends further to improve sealing resin adhesion, then adhesion is improved, but the risk of conductive connection member flow increases
Solution Approach 1:
The projection is divided into a base portion for adhesion and a locking portion for blocking. The locking portion acts as a barrier that prevents the conductive connection member from flowing along the projection, thereby eliminating the harmful effect while preserving the adhesion function of the base portion.
Solution Approach 2:
The locking portion serves as an intermediary structure between the base portion and the potential flow path of the conductive connection member. It intercepts and blocks the flow before it can reach the sealing resin, thus preventing the harmful effect without compromising the adhesion function.
3Reliability
If a locking portion is added to block conductive connection member flow, then electrical connection reliability is improved, but device complexity increases
Solution Approach 1:
The locking function is merged into the existing projection structure rather than being implemented as a separate component. The locking portion is formed as an integral part of the projection by pressing or deforming the material, which combines the adhesion function and the blocking function into a single unified structure, thereby minimizing device complexity.
Solution Approach 2:
The projection serves multiple functions simultaneously: it improves adhesion with the sealing resin through its base portion, and it prevents conductive connection member flow through its locking portion. This multi-functionality reduces the need for additional separate components, thereby limiting the increase in device complexity.
Data Source
AI summary
A semiconductor module includes a die pad frame; a semiconductor chip disposed in a chip region on an upper surface of the die pad frame, the semiconductor chip having an upper surface on which a first electrode is disposed and a lower surface on which a second electrode is disposed; a conductive connection member for die pad disposed between the second electrode of the semiconductor chip and the upper surface of the die pad frame, the conductive connection member for die pad electrically connecting the second electrode of the semiconductor chip and the upper surface of the die pad frame; and a sealing resin for sealing the semiconductor chip, the die pad frame, and the conductive connection member for die pad.