Semiconductor Module Metal Frame Thermal Dissipation

The sealing structure is segmented into two distinct parts: inner sealing resin that directly contacts and seals the electronic element, and an outer flame-retardant resin layer that provides thermal protection. This segmentation allows each layer to perform its specialized function - the inner resin ensures proper sealing while the outer layer prevents heat transmission even when carbonized

The inner sealing resin acts as an intermediary between the electronic element and the outer flame-retardant resin. It provides the primary sealing function while the outer resin serves as a thermal barrier, mediating the thermal environment to prevent heat-related failures to the electronic element

The metal frame body serves multiple functions simultaneously: it provides structural support for the semiconductor module, acts as a heat dissipation pathway, and serves as a mechanical barrier. This multi-functionality reduces the need for separate components, thereby limiting the increase in device complexity while achieving improved thermal management

The metal frame body merges structural support and thermal management functions into a single component. By combining these functions, the design avoids adding separate structural and thermal management components, thus limiting complexity increase while achieving both mechanical strength and thermal dissipation