Semiconductor Module Thermal Management via Backside Metal Plate
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Solution Overview
Problem
High-speed operation and increased memory capacity in semiconductor modules lead to inadequate heat dissipation, causing elevated operating temperatures and potential errors in memory components.
Innovation Solution
A semiconductor module design featuring a metal plate bonded to the substrate's back surface, strategically positioned to conduct heat away from memory devices and utilizing an adhesive resin layer with high thermal conductivity to enhance heat dissipation through conduction and radiation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If elements on the substrate are closely packed to increase memory capacity and operating speed, then memory capacity and speed are improved, but heat dissipation becomes insufficient and operating temperature increases
Solution Approach 1:
The substrate surface is divided into a heat generation region (controller device) and a memory device region, with heat dissipation grooves creating thermal zones. This segmentation allows heat to be managed in specific areas, directing it away from memory devices while maintaining high-density packing of elements for increased capacity and speed.
Solution Approach 2:
Heat dissipation grooves are formed in the vertical dimension (depth) of the substrate rather than only in the horizontal plane. This three-dimensional heat management structure creates thermal pathways that conduct heat away from the controller region through the substrate thickness, effectively lowering operating temperature while maintaining high element density.
2Productivity
If operating speed is increased to improve performance, then productivity is improved, but heat generation increases and reliability decreases
Solution Approach 1:
The substrate is segmented into distinct thermal management zones with grooves positioned under the controller device where heat is generated during high-speed operation. This segmentation creates dedicated heat dissipation pathways that actively manage thermal load, preventing temperature-related errors and maintaining reliability even at high operating speeds.
3Temperature
If heat dissipation structures are added to lower temperature, then temperature control is improved, but device complexity increases
Solution Approach 1:
The heat dissipation grooves are merged with the substrate manufacturing process itself, forming an integrated structure rather than adding separate components. The grooves are formed directly in the substrate material during fabrication, combining the thermal management function with the base structure and avoiding additional assembly steps or complex external heat sinks.
Solution Approach 2:
The substrate itself provides heat dissipation functionality through its own grooved structure, eliminating the need for external heat management components. The substrate serves dual purposes: as the mounting platform for devices and as an active heat dissipation structure with built-in thermal pathways that conduct heat away from high-density regions.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Effectively suppresses temperature rises in memory components by directing heat generated by the controller away from memory devices, thereby reducing operational errors and improving reliability.
Implementation Method 1
utilizing an adhesive resin layer with high thermal conductivity to enhance heat dissipation through conduction and radiation
Implementation Method 2
The generated heat is transferred by thermal conduction from the device substrate into the substrate of the semiconductor package or module and by convection and radiation from the surface of the packaged device
Data Source
AI summary
According to one embodiment, a semiconductor module includes a substrate, which has a first surface and a second surface opposite to the first surface, a controller device and a memory device formed on the first surface, and a metal plate bonded on the second surface. The metal plate is formed at least at a portion of the second surface corresponding to the controller device so that heat generated at the controller device conducts away from the memory device.