Semiconductor Module with Exposed Metallic Insulation Body

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Solution Overview

Problem

Existing semiconductor modules face challenges in efficiently radiating heat due to the need for separate insulation members between the heat radiation plate and the cooling unit, leading to increased component count, reduced assembling workability, and potential damage to ceramic thin films or displacement of insulation sheets, which affects insulating and heat radiating properties.

Innovation Solution

A semiconductor module design where a metallic body is directly formed on the outside surface of an insulation body, which is itself on the heat radiation plate, and both are molded with resin, allowing direct contact with the cooling unit without additional insulation members, ensuring reliable insulation and enhanced heat radiation.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a separate insulation member is placed between the heat radiation plate and cooling unit, then electrical insulation is ensured, but the number of component parts increases and assembling workability deteriorates

Engineering Contradiction:

Improveelectrical insulationVSAvoidnumber of component parts

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The insulation body is integrated directly onto the heat radiation plate, merging two previously separate components (insulation member and heat radiation plate) into a single integrated structure. This eliminates the need for separate insulation members while maintaining electrical insulation functionality, thereby reducing component count and improving assembling workability

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The heat radiation plate is designed to serve multiple functions: it provides thermal conduction from the semiconductor element, electrical insulation through the integrated insulation body, and structural support. This multi-functionality eliminates the need for separate insulation members, reducing device complexity while maintaining reliability

Inventive Principle:

Principle #6Universality (Multi-functionality)

2Device complexity

If a ceramic thin film is formed on the heat radiation plate, then electrical insulation is provided without separate insulation members, but the ceramic thin film is exposed to outside surface and vulnerable to external force causing cracks

Engineering Contradiction:

Improvenumber of component partsVSAvoidinsulation function

Core Design Contradiction:

Device complexityVSReliability

Solution Approach 1:

The insulation body is designed to extend beyond the ceramic thin film boundaries and cover the exposed edges of the ceramic material. This provides protective cushioning that prevents external forces from directly contacting and cracking the vulnerable ceramic thin film, while maintaining the electrical insulation function and reducing device complexity

Inventive Principle:

Principle #11Beforehand cushioning (Prior cushioning)

3Reliability

If insulation sheet is bonded to electrode plate with adhesive, then insulation is achieved, but heat resistance increases and heat radiating property deteriorates

Engineering Contradiction:

ImproveinsulationVSAvoidheat radiation efficiency

Core Design Contradiction:

ReliabilityVSLoss of energy

Solution Approach 1:

The adhesive bonding mechanism is replaced with a direct mechanical integration of the insulation body onto the heat radiation plate. This substitution eliminates the adhesive layer that caused increased heat resistance, thereby improving heat radiation efficiency while maintaining reliable electrical insulation through the integrated insulation structure

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This design enables efficient heat radiation, simplifies assembly, reduces the risk of insulation damage, and maintains insulating properties, while minimizing the module's physical size and thermal resistance.

Implementation Method 1

a heat radiation plate, placed in thermal contact with a main surface of the semiconductor element

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

an insulation body which is directly formed on an outside surface of the heat radiation plate

Methodology Applied

Scientific EffectElectrical insulation: Dielectric

Data Source

PatentUS7944045B2Semiconductor module molded by resin with heat radiation plate opened outside from mold

Publication Date: 2011.05.17 DENSO CORP

AI summary

A semiconductor module and a method of manufacturing the same are disclosed including a semiconductor element having an electrode, a heat radiation plate placed in thermal contact with a main surface of the semiconductor element and electrically connected to the electrode thereof, an insulation body directly formed on an outside surface of the heat radiation plate, a metallic body directly formed on an outside surface of the insulation body and having a thickness lower than that of the insulation body, and a mold resin unitarily molding the heat radiation plate, the semiconductor element and the insulation body. The insulation body is covered with the metallic body and the mold resin and the metallic body has an outside surface exposed to an outside of the mold resin.