Semiconductor Module Model Identification via Board Opening
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Solution Overview
Problem
In semiconductor modules with transfer mold structures, identifying the product model without deteriorating production efficiency and design freedom is challenging due to varying print locations and the need for dedicated openings on mounting boards, which increases processing costs and reduces design flexibility.
Innovation Solution
A semiconductor device design featuring a module with first and second main surfaces, a terminal protruding from the side, a mounting board on the first main surface, and a heat radiation fin on the second main surface, where the product type is printed on the first main surface and exposed through an opening in the mounting board, allowing visual recognition without removing the board and eliminating the need for a dedicated opening.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of information
If a dedicated opening is provided in the mounting board for visual recognition of the product model name, then the product identification is improved, but the processing cost increases and production efficiency deteriorates
Solution Approach 1:
The opening in the mounting board is designed to serve dual purposes: it allows the screw to pass through for securing the heat radiation fin, and simultaneously exposes the product model name printed on the first main surface for visual recognition. This multi-functional design eliminates the need for separate dedicated openings, thereby maintaining production efficiency while achieving product identification.
2Loss of information
If a dedicated opening is provided in the mounting board for visual recognition of the product model name, then the product identification is improved, but the processing cost increases
Solution Approach 1:
The opening in the mounting board is designed to serve dual purposes: it allows the screw to pass through for securing the heat radiation fin, and simultaneously exposes the product model name printed on the first main surface for visual recognition. This multi-functional design eliminates the need for separate dedicated openings, thereby maintaining production efficiency while achieving product identification.
3Loss of information
If the product type is printed on the mold surface, then the product identification is improved, but the mounting board must be removed for recognition which complicates operation
Solution Approach 1:
The opening in the mounting board acts as an intermediary that allows the product model name to be visually recognized through the mounting board itself. The opening transmits light and visual information from the printed model name on the first main surface to the observer, eliminating the need to remove the mounting board for identification while maintaining ease of operation.
4Loss of information
If a dedicated opening is provided for product identification, then the product identification is improved, but the degree of freedom in design deteriorates since wiring patterns cannot be provided in the opening
Solution Approach 1:
The opening in the mounting board is designed to serve dual purposes: it allows the screw to pass through for securing the heat radiation fin, and simultaneously exposes the product model name printed on the first main surface for visual recognition. This multi-functional design eliminates the need for separate dedicated openings, thereby maintaining production efficiency while achieving product identification.
Data Source
AI summary
A semiconductor device includes: a semiconductor module including a module main body having first and second main surfaces which are opposite to each other, and a terminal protruding from a side surface of the module main body and bent toward the first main surface; a mounting board placed on the first main surface side and connected to the terminal; a heat radiation fin placed on the second main surface side; and a screw fitting a fitting portion of the module main body from the first main surface side to the heat radiation fin, wherein the mounting board is provided with an opening at a portion facing the fitting portion, and a type of a product is printed on the first main surface and exposed from the opening of the mounting board.