Resin-Insulated Semiconductor Module for Heat and Moisture Control
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Solution Overview
Problem
Existing semiconductor devices with resin insulated substrates face challenges in efficiently releasing heat and preventing moisture-induced migration, particularly due to high water-absorption rates of sealing materials and thermal conductivity issues, which affect breakdown voltage and reliability.
Innovation Solution
A semiconductor device configuration featuring a resin insulated substrate with a first resin insulating layer, a conductor base, and conductor foils, surrounded by a case with a sealing resin, and a second resin insulating layer with a lower water-absorption rate interposed between the first resin layer and the sealing resin, to enhance heat dissipation and prevent moisture penetration.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a sealing resin with high water-absorption rate is used to seal the power semiconductor element, then the sealing performance is improved, but moisture-induced migration increases and reliability deteriorates
Solution Approach 1:
A second resin insulating layer with lower water-absorption rate than the sealing resin is introduced as an intermediary barrier between the high water-absorption sealing resin and the first resin insulating layer. This intermediate layer prevents moisture from the sealing resin from penetrating into the first resin insulating layer, thereby blocking the migration path while maintaining the sealing performance of the outer sealing resin.
Solution Approach 2:
The patent employs a composite structure combining two different resin insulating layers with distinct water-absorption characteristics. The first resin insulating layer (with heat-conductive filler) provides thermal management, while the second resin insulating layer (with lower water-absorption rate) provides moisture barrier functionality. This composite approach allows each layer to optimize its specific function without compromising the other.
2Temperature
If the thickness of the resin insulating layer is reduced to improve heat dissipation, then heat resistance decreases, but breakdown voltage may be compromised
Solution Approach 1:
The patent uses a composite resin insulating layer containing heat-conductive filler particles (such as alumina, aluminum nitride, or boron nitride) dispersed in a resin matrix. This composite structure provides both electrical insulation for breakdown voltage maintenance and enhanced thermal conductivity for heat dissipation, allowing thin layer design without sacrificing reliability.
Solution Approach 2:
The patent modifies the physical and chemical parameters of the resin insulating layer by incorporating heat-conductive filler materials with specific thermal conductivity properties. This parameter change enables the layer to simultaneously achieve low heat resistance (for heat dissipation) and high breakdown voltage (for electrical insulation), resolving the trade-off between thermal and electrical performance.
3Temperature
If ceramic insulated substrate is used to release heat, then heat releasing performance is improved, but thermal stress and bonding reliability deteriorate due to coefficient of thermal expansion difference
Solution Approach 1:
The patent changes the material parameter of the insulated substrate from ceramic to resin-based material. Resin materials have coefficient of thermal expansion values that are closer to those of the bonded components (conductor foils, heat-releasing base plate), thereby reducing thermal stress during temperature cycling while maintaining adequate heat releasing performance through the use of heat-conductive fillers.
Solution Approach 2:
The patent employs a composite resin material containing heat-conductive filler particles that provides both mechanical compatibility (reduced thermal stress) and thermal management capability. The resin matrix ensures coefficient of thermal expansion matching with bonded components, while the heat-conductive filler particles enable effective heat dissipation, replacing the ceramic substrate's thermal performance without its bonding reliability issues.
4Reliability
If resin insulated substrate is used instead of ceramic to reduce thermal stress, then bonding reliability is improved, but heat releasing performance may be insufficient
Solution Approach 1:
The patent creates a composite resin insulating layer by dispersing heat-conductive filler particles (alumina, aluminum nitride, or boron nitride) within the resin matrix. This composite structure combines the low thermal stress advantage of resin materials with the high thermal conductivity of filler particles, achieving both improved bonding reliability and sufficient heat releasing performance.
Solution Approach 2:
The patent enhances the thermal conductivity parameter of the resin insulating substrate by incorporating heat-conductive filler materials. This parameter modification allows the resin-based substrate to achieve heat releasing performance comparable to or exceeding traditional ceramic substrates, while retaining the bonding reliability advantages of resin materials.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively reduces heat resistance, maintains high breakdown voltage, and prevents moisture-induced migration, thereby improving the reliability and efficiency of heat release in power semiconductor modules.
Implementation Method 1
a second resin insulating layer provided between the first resin insulating layer and the sealing resin and having a lower water-absorption rate than the sealing resin
Implementation Method 2
a resin insulated substrate including a first resin insulating layer, a conductor base provided on one of main surfaces of the first resin insulating layer, and a conductor foil provided on another main surface of the first resin insulating layer
Data Source
AI summary
A semiconductor device includes: a resin insulated substrate including a first rein insulating layer, a conductor base provided on one of main surfaces of the first resin insulating layer, and a conductor foil provided on another main surface of the first resin insulating layer; a power semiconductor element bonded to the conductor foil; a case surrounding an outer circumference of the resin insulated substrate; a sealing resin provided inside the case to seal the power semiconductor element; and a second resin insulating layer provided between the first resin insulating layer and the sealing resin and having a lower water-absorption rate than the sealing resin.