Semiconductor Module Motor Terminal Slot Design
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The existing driver devices for motors, which use connectors to connect motor wires with semiconductor modules, result in an increased number of parts, hindering volume reduction and leading to issues with surface tension during soldering processes, causing defects like solder remaining in the connection holes.
Innovation Solution
A semiconductor module with a switching element and motor terminals featuring a molded body with a protruding base portion and a connection portion having a cutaway region forming a slot that expands outward from the insertion hole, allowing direct connection of motor wires and reducing the number of components, while the slot design breaks surface tension during solder dipping, preventing solder residue.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a connector is used to connect the motor wire and the semiconductor module, then the connection is reliable, but the number of parts increases and volume reduction is hindered
Solution Approach 1:
The motor terminal is integrated directly into the semiconductor module housing, merging the connection function with the module structure. This eliminates the need for separate connectors while maintaining reliable electrical connection between the motor wire and semiconductor module, directly resolving the contradiction between connection reliability and part reduction
2Manufacturing precision
If the insertion hole is small for precise connection, then connection precision is improved, but surface tension causes solder to remain in the hole creating defects
Solution Approach 1:
The insertion hole is segmented into two functional zones: a narrow lower portion for precise connection and positioning, and a wider upper portion (formed by the cutaway region) that prevents solder capillary action. This segmentation allows the hole to simultaneously achieve precise connection while eliminating solder residue defects
Solution Approach 2:
The cutaway region introduces a dimensional change by expanding the hole opening at the surface level while maintaining a narrow depth. This creates a flared geometry that disrupts surface tension and prevents solder from being drawn into the insertion hole during soldering processes
3Ease of manufacture
If the slot is positioned to optimize solder flow, then soldering is improved, but stress lines may be weakened
Solution Approach 1:
The slot is strategically positioned and oriented with specific dimensional characteristics (width, length, orientation) to create local structural features that optimize solder flow paths while maintaining overall structural integrity. The slot geometry is designed to provide solder access and flow control without compromising the strength of the motor terminal connection
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration reduces the number of parts in the driver device, enabling volume reduction and preventing solder residue issues, while ensuring secure connections and improved assembly by positioning the slot away from stress lines and optimizing solder wettability.
Implementation Method 1
the slot breaks the surface tension of the coating material (i.e., a liquid, or a melted solder) in the course of pulling lifting the motor terminal therefrom
Data Source
AI summary
A semiconductor module includes a switching element, a molded body, and a motor terminal. The molded body having the switching element disposed therein. The motor terminal has a base portion and a connection portion having an insertion hole into which a motor wire is inserted and connected with the winding wire. The connection portion has a cutaway region that defines a slot. The winding wire of the motor and the semiconductor module are connected via the motor wire and the motor terminal, thereby reducing the number of components used for such connection compared with a connection that uses a connector, and achieving a volume reduction of the semiconductor module and a driver device using the same.