Semiconductor Module Multilayer Wiring Insulation
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Solution Overview
Problem
The existing semiconductor modules face challenges in miniaturization while maintaining the necessary insulation distance between wiring patterns, leading to increased size and potential disconnection risks due to thermal stress and vibration.
Innovation Solution
A semiconductor module design featuring a multilayer substrate with conductive layers and control wiring layers arranged in a specific configuration, where the first and second semiconductor elements are intersectingly positioned, and the control wiring layers extend under the main wiring members, reducing gaps between circuit boards and ensuring insulation distance, thereby enabling miniaturization.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the insulation distance between wiring patterns is increased to satisfy withstand conditions, then the reliability is improved, but the module size increases
Solution Approach 1:
The patent transitions from a planar arrangement of wiring patterns to a three-dimensional multilayer substrate structure. Control wiring layers are positioned on different layers (above or below) main circuit wiring layers, allowing insulation distances to be achieved through vertical separation rather than horizontal spacing. This dimensional change enables compact module size while maintaining adequate insulation distances for reliability.
2Productivity
If the module size is reduced for miniaturization, then the productivity is improved, but the insulation distance between wiring patterns decreases
Solution Approach 1:
By utilizing vertical space through multilayer construction, the patent achieves miniaturization in the planar dimensions while preserving insulation distances in the vertical dimension. Control wiring layers are disposed above or below main circuit wiring layers, enabling compact footprint without compromising electrical insulation requirements.
3Reliability
If gate leads and source leads are disposed separately from the main circuit, then the reliability is improved, but the device complexity increases
Solution Approach 1:
The patent merges control wiring layers with the multilayer substrate structure, integrating gate leads and source leads into the same substrate as main circuit wiring. This consolidation maintains electrical separation and reliability while reducing overall device complexity compared to using separate substrates or mounting structures for control leads.
Data Source
AI summary
A semiconductor module includes a multilayer substrate having an insulating plate on which first to third conductive layers respectively connected to positive, negative and output electrode terminals are arranged in a first direction, a plurality of first semiconductor elements each having top and bottom electrodes on the first conductive layer and arranged in a second direction orthogonal to the first direction, a plurality of second semiconductor elements each having top and bottom electrodes on the second conductive layer and arranged in the second direction, first and second main wiring members each connecting the top electrode of each first and second semiconductor element to the second and third conductive layers. The multilayer substrate includes a first control wiring layer extending in the second direction and passing under the first main wiring member, and a second control wiring layer extending in the second direction and passing under the second main wiring member.