Full-Bridge Semiconductor Module Temperature Sensing Noise Control
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Solution Overview
Problem
Conventional semiconductor modules face challenges in accurately detecting temperature, particularly those using wideband gap semiconductor elements that generate significant heat, necessitating improved temperature detection methods.
Innovation Solution
A semiconductor module design incorporating a temperature detection element within a full bridge circuit, with capacitors and capacitive coupling reducing wiring patterns to stabilize output voltage and reduce noise, ensuring accurate temperature detection near heat sources.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If a temperature detection element is placed near heat generation sources in wideband gap semiconductor modules, then temperature detection accuracy is improved, but noise from switching paths interferes with detection stability
Solution Approach 1:
Capacitors are introduced as intermediary elements between the temperature detection element and the switching paths. These capacitors act as mediators that block high-frequency noise from the switching operations while allowing the temperature detection signal to pass through, thereby resolving the conflict between proximity to heat sources and noise interference
Solution Approach 2:
The harmful switching noise is extracted and isolated from the temperature detection path by using capacitors to separate the detection circuit from the switching paths. This extraction allows the temperature detection element to remain near heat sources while the noise is removed through the capacitive coupling arrangement
2Stability of the object's composition
If capacitance balancing components are added to reduce noise, then temperature detection stability is improved, but device complexity increases
Solution Approach 1:
The capacitors serve multiple functions simultaneously: they block switching noise, balance the capacitance in the detection path, and provide a reference potential. This multi-functionality achieves detection stability without requiring separate components for each function, thereby limiting the increase in device complexity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design enables stable and accurate temperature detection by balancing capacitances and reducing noise, enhancing the module's temperature detection capabilities.
Implementation Method 1
a first capacitor that is disposed between a first temperature detection path that extends from the first temperature detection electrode to the first temperature detection terminal and a common portion between the first current path and the fourth current path; and a second capacitor that is disposed between the first temperature detection path and a common portion between the second current path and the third current path
Data Source
AI summary
A semiconductor module includes first to fourth semiconductor elements, a plurality of wiring patterns, a first power source terminal, second power source terminals, a first intermediate point terminal and a second intermediate point terminal. The semiconductor module has a full bridge circuit in which a first switching path that includes a first current path and a second current path and a second switching path that includes a third current path and a fourth current path are formed exclusively by a switching operation. The semiconductor module includes a temperature detection element in a region surrounded by the first and the second switching path; a first capacitor between a first temperature detection path and a common portion between the first current path and the fourth current path; and a second capacitor between the first temperature detection path and a common portion between the second current path and the third current path.